Patents by Inventor Gerd R. Ley

Gerd R. Ley has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Apparatus and method for the placement and bonding of a die on a substrate
    Patent number: 6640423
    Abstract: An improved apparatus and method for the placement and bonding of a die on a substrate includes a movable die holder, a movable substrate holder, a pivoting transfer arm that picks a die from the movable die holder and transfers the die to a position adjacent the movable substrate holder, and a bondhead assembly for picking the die from the transfer arm and then bonding the die to the substrate.
    Type: Grant
    Filed: July 18, 2000
    Date of Patent: November 4, 2003
    Assignee: Endwave Corporation
    Inventors: Edwin F. Johnson, Gerd R. Ley, Douglas G. Lockie, Clifford A. Mohwinkel