Patents by Inventor Gerd Scheller

Gerd Scheller has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20050105628
    Abstract: A system with a transmitter for transmitting digital data via an interface to a receiver. The interface has at least one data line and a clock line. A clock generator supplies a clock signal to the clock line. The receiver uses the clock signal received from the clock line for deriving timing information for processing received digital data. The clock signal may have an amplitude that is lower than the power supply voltage VDD, typically less than half of the power supply voltage, and less stringent requirements can be applied to the waveform of the clock signal than traditionally applied to data and clock signals. The clock signals are hereby less power consuming and cause significantly less electromagnetic interference.
    Type: Application
    Filed: December 9, 2002
    Publication date: May 19, 2005
    Inventors: Stephan Koch, Gerd Scheller, Rolf Becker
  • Patent number: 6383864
    Abstract: A memory cell, which includes a transistor and a capacitor, for use in a DRAM uses a silicon-filled vertical trench as the capacitor and a vertical transistor superposed over the vertical trench in a silicon chip. An epitaxial layer is formed at the top of the fill in the trench to impart seed information to the primarily polysilicon silicon fill in the trench. A polysilicon layer is deposited over the top surface of the chip, is apertured over the top of the trench, and has its sidewalls oxidized. The opening is then refilled with epitaxial silicon in which there is created in operation an inversion layer that serves as the channel of the transistor, and the deposited polysilicon layer serves as the word line. Another silicon layer is deposited over the epitaxial layer to serve as the bit line. The source/drain regions of the transistor are formed at the merger of the deposited layer with the fill in the trench and the merger with the polysilicon layer that serves as the bit line.
    Type: Grant
    Filed: September 30, 1997
    Date of Patent: May 7, 2002
    Assignee: Siemens Aktiengesellschaft
    Inventors: Gerd Scheller, Martin Gall, Reinhard J. Stengl
  • Publication number: 20020001900
    Abstract: A memory cell, which includes a transistor and a capacitor, for use in a DRAM uses a silicon-filled vertical trench as the capacitor and a vertical transistor superposed over the vertical trench in a silicon chip. An epitaxial layer is formed at the top of the fill in the trench to impart seed information to the primarily polysilicon silicon fill in the trench. A polysilicon layer is deposited over the top surface of the chip, is apertured over the top of the trench, and has its sidewalls oxidized. The opening is then refilled with epitaxial silicon in which there is created in operation an inversion layer that serves as the channel of the transistor, and the deposited polysilicon layer serves as the word line. Another silicon layer is deposited over the epitaxial layer to serve as the bit line. The source/drain regions of the transistor are formed at the merger of the deposited layer with the fill in the trench and the merger with the polysilicon layer that serves as the bit line.
    Type: Application
    Filed: September 30, 1997
    Publication date: January 3, 2002
    Inventors: GERD SCHELLER, MARTIN GALL, REINHARD J. STENGL