Abstract: In the production of printed circuit boards it is required that organic protective coatings adhere tightly on the copper surfaces. Accordingly, matt layers of copper are to be preferred over lustrous coatings. The bath in accordance with the invention serves to deposit matt layers of copper and has the additional advantageous property that the layers may also be deposited with sufficient coating thickness in very narrow bore holes at average cathode current density. For this purpose the bath contains at least one polyglycerin compound selected from the group comprising poly(1,2,3-propantriol), poly(2,3-epoxy-1-propanol) and derivatives thereof.

Abstract: In the production of printed circuit boards it is required that organic protective coatings adhere tightly on the copper surfaces. Accordingly, matt layers of copper are to be preferred over lustrous coatings. The bath in accordance with the invention serves to deposit matt layers of copper and has the additional advantageous property that the layers may also be deposited with sufficient coating thickness in very narrow bore holes at average cathode current density. For this purpose the bath contains at least one polyglycerin compound selected from the group comprising poly(1,2,3-propantriol), poly(2,3-epoxy-1-propanol) and derivatives thereof.

Abstract: For the uniform electrolytic deposition of copper coatings, especially on printed circuit boards, an aqueous deposition bath is used which contains as constituents at least one source of copper ions, at least one compound increasing the electrical conductivity of the deposition bath as well as at least one additive, at least one transformation product, formed from epihalohydrins, dihalohydrins or respectively 1-halogen-2,3-propanediols and polyamidoamines being contained as the additive. The polyamidoamines are formed by the condensation reaction of dicarboxylic acids with polyalkylene polyamines. When copper coatings are deposited from this bath, copper layers of uniform layer thickness can be deposited.

Abstract: A process with the following process steps is used to electrolytically deposit copper layers, especially on printed circuit boards. An electrically-conductive substrate and anodes that decompose upon electrolytic deposition are brought into contact with a deposition bath. The deposition bath contains copper ions, compounds that increase the electrical conductivity of the deposition bath, additives to influence the material properties of the copper layers, additional compounds of an electrochemically reversible redox system, and solvents or solvent mixtures. The substrate and the electrodes are connected to a power supply. The copper layers are deposited on the substrate using a pulsed current or a pulsed voltage process. When this process is used, metal layers with favorable visual and mechanical material properties are deposited after a brief bath preparation time.

Abstract: An alkaline - cyanide free or substantially cyanide-free bath is provided for the electrodeposition of a bright levelled zinc coating; said bath containing a zinc salt, alkali hydroxide and conventional additives and a reaction product of unsaturated nitrogen heterocyclic hydrocarbon compounds containing at least two nitrogen atoms in the ring with epihalogen hydrin or glycerol halogen hydrin.