Abstract: A connecting device for connection to an electrical connection system of a solar module comprises a connector housing for arranging on an outer face of the solar module and current-carrying components arranged in the connector housing, which components comprise at least one contact for connection to a conductor of the electrical connection system of the solar module, which conductor leads out from the solar module. A connection device, which may be arranged inside the connector housing, for positioning the conductor which leads out from the solar module is also provided, it being possible for the connection device and the contact to be arranged relative to one another in such a way that the contact is initially guided contactlessly along the conductor which leads out, so as to contact said conductor which leads out, and contacts the conductor which leads out in an end position. Reliable contact is thus possible without displacing the conductor which leads out.

Abstract: A connecting device for connection to an electrical connection system of a solar module comprises a connector housing for arranging on an outer face of the solar module and current-carrying components arranged in the connector housing, which components comprise at least one contact for connection to a conductor of the electrical connection system of the solar module, which conductor leads out from the solar module. A connection device, which may be arranged inside the connector housing, for positioning the conductor which leads out from the solar module is also provided, it being possible for the connection device and the contact to be arranged relative to one another in such a way that the contact is initially guided contactlessly along the conductor which leads out, so as to contact said conductor which leads out, and contacts the conductor which leads out in an end position. Reliable contact is thus possible without displacing the conductor which leads out.

Abstract: An electronic device has an opening for up to two data carrier devices or, respectively, chip cards with row-type contact surfaces positioned alongside one another. The devices or, cards are stackable over one another in offset fashion. In a region of the terminal side lying opposite the plug opening it comprises two rows of contact springs lying next to one another, said rows being spatially offset upwards by the height of a card, and also offset in the insertion direction in a manner corresponding to the card offset. The resilient ends at the plug side of these contact springs respectively contact the contact surfaces of inserted data carriers from above.