Abstract: Primers, essentially consisting of a film former or matrix former, an additive, an ionic and/or colloidal noble metal, a filler and a solvent, are suitable for coating substrate surfaces for subsequent chemical metallization.

Abstract: Injection-moulded printed circuit boards which have been obtained by injection-moulding thermoplastic materials onto the back of flexible circuits are of a particularly high quality if the conductor tracks have been produced on the flexible carriers employed by direct additive or semiadditive metallisation.

Abstract: Activator formulations which contain an aromatic polyurethane as binder are highly suitable for the preparation of non-metallic substrate surfaces for currentless metallization.The metal coatings produced are distinguished by good adhesion.

Abstract: Formulations containing an organometallic activator, a filler, a special mixture of organic solvents and a PU elastomer are eminently suitable for activating plastic surfaces for their electroless metallization avoiding stress-corrosion cracking.The plastic parts so activated are preferably used for screening from electromagnetic waves after metallization has been carried out.

Abstract: Conductor boards with well adhering conductor tracks are obtained if the substrates, which are clad on both sides with copper foils, have said cladding removed chemically or mechanically, are activated, if necessary sensitized, and are provided with a 0.05-2.0 .mu.m thick layer of nickel, cobalt, manganese, a nickel/iron or nickel/cobalt mixture in an electroless metallizing bath, a 0.5-5.0 .mu.m thick copper layer is applied in a subsequent copper bath and the conductor pattern is then built up by the standard semi-additive methods.

Abstract: To improve the adhesive strength of electrolessly deposited metal deposits on surfaces of polyimide moulded bodies, the latter are treated with an activator formulation which, in addition to solvents, fillers and organometallic activators, preferably contains 5-25% of a polyimide as binder.

Abstract: Flexible circuits are obtained in an elegant manner, without the customary etching methods, wet-chemically in accordance with the principles of semiadditive or fully additive technology by using for the activation noble metal activators and, as base material, films or flexible boards whose surface has (a) a specific total pore volume per unit area of 0.015-0.045 dm.sup.3/ m.sup.2, (b) an average pore diameter of 0.05-5.0 .mu.m and (c) an average pore depth of 0.05-4.0 .mu.m.

Abstract: Activator formulations which contain copolymers of (meth)acrylonitrile, styrenes, acrylates and/or unsaturated acids as binders are excellently suitable for preparing nonmetallic substrate surfaces for electroless metallization.The metal deposits produced are notable for good bond strength.

Abstract: An elegant method for the production of printed circuit boards possessing good electrical and mechanical properties comprises activating baseplates with a solution of complex compounds of elements of sub-group I or VIII of the periodic table, then applying a resist layer, exposing this partially according to a resist pattern, dissolving away the covered parts of the resist layer with a solvent, and metallizing the bared parts in a wet-chemical metallization bath in the absence of a current.

Abstract: Polymer membranes metallized by wet chemistry are highly suitable, for example, for the separation of inert, reactive and fermentation gases.The metallization is carried out after activation with noble-metal complex compounds which have at least two functional groups.Preferred metal coatings are those of Cu, Co and Ni.

Abstract: A mild and simple process of activating substrate surfaces for the purpose of currentless metallization comprises using organometallic compounds of elements of the groups 1B and 8 of the Periodic System of Elements whose organic moiety has at least one functional group over and above the groups required for binding the metal are used for activation.

Abstract: A process suitable for the fully additive technique for the electroless partial metallization of substrate surfaces consists in treating the surface with photosensitive silver(I) compounds (e.g. carboxylic acid salts), partially exposing the silver(I) compounds left behind on the surfaces, if necessary intensifying the exposure effect and/or exchanging the silver produced during the exposure for nobler metals, and detaching the unexposed silver(I) compounds.

Abstract: Electrical printed circuit boards are obtained in an elegant manner without the usual etching methods and without using bonding agent layers in a wet chemical manner on the basis of the principles of the semi or fully additive technique by using precious metal compounds for activation and base material of a type which has (a) a specific total pore volume per unit area of 0.015-0.045 dm.sup.3 /m.sup.2, (b) a mean pore diameter of 0.05-5.0 .mu.m and (c) a mean pore depth of 0.05-4.0 .mu.m.

Abstract: Activation baths containing an organometallic compound based on elements of sub-group 1 or 8 of the periodic table with a "guest/host" interrelationship are outstandingly suitable for electroless metallization of preferably non-metallic substrates. Activators of palladium compounds and cyclic crown ethers are particularly suitable.

Abstract: For the electroless metallization of base carriers for the manufacture of printed circuit boards, those carrier materials are outstandingly suitable on which complex compounds are built up in which the ligands and the ions to be complexed have entered a "host-guest interrelationship". Examples of such activator compounds are complexes of crown ethers, cryptands and the like. The resulting printed circuit boards are distinguished by the high adhesive strengths of the metals deposited on them.

Abstract: A simple and mild method of activating substrate surfaces for currentless metallization involves activating by means of organometallic compounds of elements of the 1st and 8th sub-Groups of the Periodic Table of Elements in which the organic moiety consists of oligomeric, prepolymeric or polymeric compounds containing double bonds.

Abstract: A fabric reinforced composite having increased bond strength between impregnating resin and polyaramide reinforcing fabric and method for making the composite including using metal coated polyaramide fabric as the reinforcing material. The metal is deposited by a non-electrical method.

Abstract: Complex compounds of elements of sub-groups 1 and 8 of the periodic table in oxidation stages 1-4 with unsaturated ketones of the formula ##STR1## wherein R.sub.1 and R.sub.4 denote alkyl, cycloalkyl or aryl andR.sub.2 and R.sub.3 denote hydrogen or alkyl, are outstandingly suitable for activating substrate surfaces for electroless metallization since these complexes are distinguished by a high storage stability. The palladium complexes of but-3-en-2-one and hept-3-en-2-one are preferred.

Abstract: Metallized, particularly nickel-coated, knitted net fabrics are suitable for protecting the eyes against microwave radiation with very little adverse effect upon the field of vision, particularly when the mesh width of the knitted net fabrics amounts to <0.25 .lambda., preferably <0.1 .lambda., .lambda. being the wavelength of the radiation to be screened off at the upper frequency limit.

Abstract: A mild activation process for the adhesion-activation of polyamide mouldings for electroless metallization comprises treating the substrates, successively or simultaneously, with the solution of a mixture of CaCl.sub.2, LiCl and/or MgCl.sub.2 with AlCl.sub.3, FeCl.sub.3 and/or TiCl.sub.4 in a lower alcohol and with an activator solution based on inorganic complex compounds of the formulaM.sup.n+ [E.sup.m+ Hal.sub.z.sup.- ]in whichM represents two hydrogen or alkali metal atoms or one alkaline earth metal atom,Hal represents a halogen, preferably Cl, andE represents a noble metal atom of the 1st or 8th subgroup of the periodic table, having the valency m and the coordination number z (z-m=n),or with customary colloidal or ionic systems of these noble metals.