Abstract: An interposer-type component carrier includes a stack comprising at least one electrically conductive layer structure and at least one electrically insulating layer structure; a cavity formed in an upper portion of the stack; an active component embedded in the cavity and having at least one terminal facing upwards; and a redistribution structure having only one electrically insulating layer structure above the component. A method of manufacturing an interposer-type component carrier is also disclosed.

Abstract: A component carrier includes a stack with electrically conductive layer structures and at least one electrically insulating layer structure. The electrically conductive layer structures have a higher density connection region and a lower density connection region, and a first component and a second component which are surface-mounted on the stack. The first component and the second component are electrically coupled with each other by the higher density connection region.

Abstract: An interposer-type component carrier includes a stack comprising at least one electrically conductive layer structure and at least one electrically insulating layer structure; a cavity formed in an upper portion of the stack; an active component embedded in the cavity and having at least one terminal facing upwards; and a redistribution structure having only one electrically insulating layer structure above the component. A method of manufacturing an interposer-type component carrier is also disclosed.

Abstract: An interposer-type component carrier includes a stack comprising at least one electrically conductive layer structure and at least one electrically insulating layer structure; a cavity formed in an upper portion of the stack; an active component embedded in the cavity and having at least one terminal facing upwards; and a redistribution structure having only one electrically insulating layer structure above the component. A method of manufacturing an interposer-type component carrier is also disclosed.

Abstract: An interposer-type component carrier includes a stack comprising at least one electrically conductive layer structure and at least one electrically insulating layer structure; a cavity formed in an upper portion of the stack; an active component embedded in the cavity and having at least one terminal facing upwards; and a redistribution structure having only one electrically insulating layer structure above the component. A method of manufacturing an interposer-type component carrier is also disclosed.

Abstract: In a method for processing a plurality of printed circuit boards, comprising the following steps: providing a plurality of printed circuit boards, providing at least one frame element, for coupling to a plurality of printed circuit boards, coupling or the printed circuit boards to the at least one frame element, processing the printed circuit boards in the state coupled to the frame element, it is provided that printed circuit boards of different sizes and/or thicknesses and/or of different constructions are coupled to the at least one frame element to form a composite assembly and are subjected to further processing in the composite assembly formed by the printed circuit boards and the at least one frame element. Furthermore, a composite assembly for processing a plurality of printed circuit boards and also a use of such a method and composite assembly are provided.

Abstract: A printed circuit board comprised of a plurality of interconnected elements, wherein at least two elements to be connected of the printed circuit board are mechanically connected, particularly bonded or glued, with one another on at least one peripheral region thereof, while keeping a distance and being supported on a carrier element.

Abstract: The invention relates to a method for connecting a plurality of elements for a circuit board, comprising the following steps: providing the elements of a circuit board to be connected to each other, the elements having contours adapted to each other; arranging the elements to be connected to each other in close proximity in at least one of two peripheral areas that have complementary contours, while maintaining a distance between opposing peripheral areas; and mechanically connecting the opposing peripheral areas by means of at least one sub-area thereof in order to connect the elements of the circuit board to be connected to each other. Furthermore, a circuit board produced from a plurality of elements connected to each other is provided.

Abstract: This publication discloses a circuit-board construction and a method for manufacturing an electronic module, in which method at least one component (6) is embedded inside an insulating-material layer (1) and contacts (14) are made to connect the component (6) electrically to the conductor structures (14, 19) contained in the electronic module. According to the invention, at least one thermal via (22), which boosts the conducting of heat away from the component (6) is manufactured in the insulating-material layer (1) in the vicinity of the component (6).

Abstract: This publication discloses a circuit-board construction and a method for manufacturing an electronic module, in which method at least one component (6) is embedded inside an insulating-material layer (1) and contacts (14) are made to connect the component (6) electrically to the conductor structures (14, 19) contained in the electronic module. According to the invention, at least one thermal via (22), which boosts the conducting of heat away from the component (6) is manufactured in the insulating-material layer (1) in the vicinity of the component (6).

Abstract: In a method for producing a circuit board element, the following steps are provided: providing a substantially whole-area carrier having an adhesive surface; arranging and fixing a starting material of the circuit board element to be produced on the adhesive surface of the carrier; producing the circuit board element fixed on the carrier in a position fixed on the carrier; and removing the produced circuit board element from the carrier. Furthermore, a carrier for use in such a method is provided, wherein it is possible, in particular, to dispense with complex steps for separating or singulating circuit board elements and, with conservation of resources as a result of reusability of a carrier, it is possible to obtain cost savings in the production of circuit board elements.

Abstract: In a method for processing or treating a plurality of printed circuit boards, comprising the following steps: providing a plurality of printed circuit boards (4, 5, 6, 7). providing at least one frame or carrier element (2, 3), for coupling to a plurality of printed circuit boards (4, 5, 6, 7), coupling or connecting the printed circuit boards (4, 5, 6, 7) to the at least one frame or carrier element (2, 3), processing or treating the printed circuit boards (4, 5, 6, 7) in the state coupled to the frame or carrier element (2, 3), it is provided that printed circuit boards (4, 5, 6, 7) of different sizes and/or thicknesses and/or of different constructions are coupled to the at least one frame or carrier element (2, 3) to form a composite assembly (1) and are subjected to further processing in the composite assembly (1) formed by the printed circuit boards (4, 5, 6, 7) and the at least one frame or carrier element (2, 3).

Abstract: This publication discloses a circuit-board construction and a method for manufacturing an electronic module, in which method at least one component (6) is embedded inside an insulating-material layer (1) and contacts (14) are made to connect the component (6) electrically to the conductor structures (14, 19) contained in the electronic module. According to the invention, at least one thermal via (22), which boosts the conducting of heat away from the component (6) is manufactured in the insulating-material layer (1) in the vicinity of the component (6).