Abstract: In an embodiment a sensor arrangement includes a sensor element including a ceramic base body and at least two electrodes, wherein the electrodes are arranged on an outer side of the ceramic base body, at least two contacting elements configured for making electrical contact with the sensor element, the contacting elements being connected to the electrodes in a connection region and a glass sheath, wherein at least the ceramic base body and the connection region are completely enclosed in the glass sheath, wherein the glass sheath is pressure tensioned, and wherein a coefficients of expansion of the glass sheath, the contacting elements and the sensor element are adapted to one another for the pressure tensioning of the glass sheath.

Abstract: A method for applying a coating to at least one electronic component. The method includes providing a coating carrier having a main base, a coating base having a recess, and a moveable reservoir having a further recess. The method further includes filling a coating material into the recess of the reservoir; sliding the reservoir along a longitudinal axis of the coating carrier such that the recess of the coating base is filled with coating material; providing an electronic component and dipping at least parts of the electronic component into the coating material provided in the recess of the coating base to form a coating of the electronic component. Furthermore, a sensor arrangement for measuring a temperature is described having a coating applied by the method. A coating carrier for applying a coating to an electronic component is described.

Abstract: In an embodiment a method for assembling NTC sensor includes providing an NTC thermistor element and connection wires having terminals for contacting the NTC thermistor element; and self-heating the NTC thermistor element while applying an electrical current during the following steps: dispensing solder paste to the terminals of the connection wires, applying the connection wires to the NTC thermistor element and melting the solder paste by a generated heat of the NTC thermistor element thereby forming solder bonds between the NTC thermistor element and the connection wires.

Abstract: A method for applying a coating to at least one electronic component. The method includes providing a coating carrier having a main base, a coating base having a recess, and a moveable reservoir having a further recess. The method further includes filling a coating material into the recess of the reservoir; sliding the reservoir along a longitudinal axis of the coating carrier such that the recess of the coating base is filled with coating material; providing an electronic component and dipping at least parts of the electronic component into the coating material provided in the recess of the coating base to form a coating of the electronic component. Furthermore, a sensor arrangement for measuring a temperature is described having a coating applied by the method. A coating carrier for applying a coating to an electronic component is described.

Abstract: In an embodiment a NTC sensor include a chip, two parallel wires, each wire having contact points, and contact-connections between the chip and the contact points of each of the wires, wherein a maximum lateral dimension of the NTC sensor in any direction perpendicular to a direction of extension of the wires is equal to or less than a sum of the lateral dimensions of the chip and the wires.

Abstract: A method for applying a coating to at least one electronic component. The method includes providing a coating carrier having a main base, a coating base having a recess, and a moveable reservoir having a further recess. The method further includes filling a coating material into the recess of the reservoir; sliding the reservoir along a longitudinal axis of the coating carrier such that the recess of the coating base is filled with coating material; providing an electronic component and dipping at least parts of the electronic component into the coating material provided in the recess of the coating base to form a coating of the electronic component. Furthermore, a sensor arrangement for measuring a temperature is described having a coating applied by the method. A coating carrier for applying a coating to an electronic component is described.

Abstract: In an embodiment a sensor arrangement includes a sensor element including a ceramic base body and at least two electrodes, wherein the electrodes are arranged on an outer side of the ceramic base body, at least two contacting elements configured for making electrical contact with the sensor element, the contacting elements being connected to the electrodes in a connection region and a glass sheath, wherein at least the ceramic base body and the connection region are completely enclosed in the glass sheath, wherein the glass sheath is pressure tensioned, and wherein a coefficients of expansion of the glass sheath, the contacting elements and the sensor element are adapted to one another for the pressure tensioning of the glass sheath.