Abstract: A multiple insertion head for mounting components onto substrates includes a carrier configured to rotate about a rotational axis, a plurality of active drives, and a plurality of receiving tools configured to move in a mounting direction at an angle to the rotational axis. The receiving tools are arranged on the carrier so as to receive the components. Each receiving tool is permanently coupled to one of the active drives.

Abstract: The invention relates to a multiple insertion head for mounting components onto substrates, the insertion head including a carrier which is arranged in such a way that it can rotate about a rotational axis and is provided with many receiving tools that are arranged in such a way that they can be displaced in a mounting direction at an angle to the rotational axis, the receiving tools being used to receive the components. Each receiving tool is provided with at least one active drive and/or sensor, ensuring that the components are rapidly positioned with the highest precision.

Abstract: The invention relates to a multiple insertion head for mounting components (300) onto substrates, said insertion head comprising a carrier (200) which is arranged in such a way that it can rotate about a rotational axis (D) and is provided with a plurality of receiving tools (210) that are arranged in such a way that they can be displaced in a mounting direction at an angle to the rotational axis (D), said receiving tools being used to receive the components (300). Each receiving tool (210) is provided with at least one active drive and/or sensor, ensuring that the components (300) are rapidly positioned with the highest precision.

Abstract: An optical check for electrical components on an equipping head is provided by moving the suction pipette of the equipping head with the component affixed thereto passed a line sensor that is parallel to the axial direction of the suction pipette. The free end of the suction pipette and the component proceed into the sensor region. The sensor values for the empty suction pipette are compared in an evaluation unit to sensor values of the suction pipette equipped with the component. The presence of the component and/or the height of the component and/or the length of the component are determined by the comparison.

Abstract: A device for observing the ends of optical waveguides, which ends are being adjusted relative to each other for splicing purposes, characterized by two separate microscopes arranged to view adjustments along two perpendicularly extending directions. Each of the microscopes has a mirror arrangement for bending the optical paths onto a common intermediate image plane and the microscopes have a common eyepiece for observing the common intermediate image plane so that adjustments along both directions can be observed without changing eyepieces. Preferably, a diaphragm is provided to be alternately moved into the path of one microscope to block the vision while observing the view of the other microscope.

Abstract: A device for splicing light waveguides, such as optical fibers, having an internal sheath and an outer sheath, characterized by an arrangement for clamping each of the waveguides by engaging their sheaths and lowering the unsheathed end portion into a centering groove where the ends are heated and fused together by an alternating current discharge path. The required convergence and alignment of the light waveguide ends during the welding step are automatically controlled by an advanced arrangement which is sequentially controlled with the welding step. Subsequent to the gearing of the ends, the clamping element releases the waveguides adjacent to the fused joint and are moved by a restoring arrangement to stretch the joint into a straight line position.