Abstract: A method of forming packaging accommodates one or more products and packaging produced by the method. The method includes providing a planar packaging blank of foldable material and assembling it into packaging capable of accommodating at least one product. A flexible electronics module on the packaging blank has at least one temperature measurement device and a temperature display to measure and display the temperature of at least one of the products. The positioning of the flexible electronics module with respect to the packaging permits both to be folded together to form the assembled packaging. The packaging is foldable from a first unassembled state to a second assembled state to accommodate at least one product, and the electronics module is at least partly flexible to enable it to be folded with the packaging. The packaging may hold six beverage containers and might be considered to be a “six pack.

Abstract: A method of forming packaging accommodates one or more products and packaging produced by the method. The method includes providing a planar packaging blank of foldable material and assembling it into packaging capable of accommodating at least one product. A flexible electronics module on the packaging blank has at least one temperature measurement device and a temperature display to measure and display the temperature of at least one of the products. The positioning of the flexible electronics module with respect to the packaging permits both to be folded together to form the assembled packaging. The packaging is foldable from a first unassembled state to a second assembled state to accommodate at least one product, and the electronics module is at least partly flexible to enable it to be folded with the packaging. The packaging may hold six beverage containers and might be considered to be a “six pack.

Abstract: A method of forming packaging accommodates one or more products and packaging produced by the method. The method includes providing a planar packaging blank of foldable material and assembling it into packaging capable of accommodating at least one product. A flexible electronics module on the packaging blank has at least one temperature measurement device and a temperature display to measure and display the temperature of at least one of the products. The positioning of the flexible electronics module with respect to the packaging permits both to be folded together to form the assembled packaging. The packaging is foldable from a first unassembled state to a second assembled state to accommodate at least one product, and the electronics module is at least partly flexible to enable it to be folded with the packaging. The packaging may hold six beverage containers and might be considered to be a “six pack.

Abstract: The invention relates to a method in which a layer compound having a substrate having an adhesive layer applied thereon at least in regions is provided. An opening extending through the substrate and through the adhesive layer is introduced therein in order to obtain a patterned layer compound. A microchip having an active region arranged on the outside of the chip is provided, wherein the active region is a sensor area or a radiation coupling-out area. In addition, in accordance with the invention, the microchip is arranged on the adhesive layer of the patterned layer compound such that the active region is exposed through the opening.

Abstract: A method of forming packaging accommodates one or more products and packaging produced by the method. The method includes providing a planar packaging blank of foldable material and assembling it into packaging capable of accommodating at least one product. A flexible electronics module on the packaging blank has at least one temperature measurement device and a temperature display to measure and display the temperature of at least one of the products. The positioning of the flexible electronics module with respect to the packaging permits both to be folded together to form the assembled packaging. The packaging is foldable from a first unassembled state to a second assembled state to accommodate at least one product, and the electronics module is at least partly flexible to enable it to be folded with the packaging. The packaging may hold 6 beverage containers and might be considered to be a “six pack.

Abstract: The present invention provides a method for producing integrated circuits which are mechanically flexible and can be provided contiguously on a common flexible carrier substrate. The method includes a step of continuously providing a first flexible substrate which has conductor-line patterns, and a step of mounting the integrated circuits on the first flexible substrate and connecting the integrated circuits to the conductor-line patterns of the first flexible substrate, and a step of covering the circuits mounted on the first flexible substrate with a second flexible substrate, recesses being provided in the first or second flexible substrates in order to make the conductor-line patterns of the first flexible substrate accessible.

Abstract: The present invention provides a method for producing integrated circuits which are mechanically flexible and can be provided contiguously on a common flexible carrier substrate. The method includes a step of continuously providing a first flexible substrate which has conductor-line patterns, and a step of mounting the integrated circuits on the first flexible substrate and connecting the integrated circuits to the conductor-line patterns of the first flexible substrate, and a step of covering the circuits mounted on the first flexible substrate with a second flexible substrate, recesses being provided in the first or second flexible substrates in order to make the conductor-line patterns of the first flexible substrate accessible.

Abstract: The present invention provides a method for producing integrated circuits which are mechanically flexible and can be provided contiguously on a common flexible carrier substrate. The method includes a step of continuously providing a first flexible substrate which has conductor-line patterns, and a step of mounting the integrated circuits on the first flexible substrate and connecting the integrated circuits to the conductor-line patterns of the first flexible substrate, and a step of covering the circuits mounted on the first flexible substrate with a second flexible substrate, recesses being provided in the first or second flexible substrates in order to make the conductor-line patterns of the first flexible substrate accessible.

Abstract: An installation for manually assemblying electrical and electronic components on a printed circuit board using a display device for optically identifying the respective assembly positions of the component on the board, at least one magazine with a removable position for supplying the required component and an arithmetic unit for controlling the display device and selection of the particular magazine characterized by the magazine being designed to carry all components for a large number of different printed circuit boards and an identification device which is connected to the arithmetic unit to identify the particular circuit board which is being supplied, sending a signal to the arithmetic unit to identify the board so that the arithmetic unit provides the necessary assembly program.