Abstract: A soldering iron includes a housing for accommodating therein at least one heating element and a soldering bit which is releasably secured to the housing. The heating element includes a heat-transmitting contact surface provided on an end face thereof which faces the soldering bit. A heat reception surface of said soldering bit is located opposite the contact surface and in direct contact therewith with no intermediate layer therebetween. A temperature sensor is located adjacent the contact surface and between the contact surface and a filament winding of the heating element.

Abstract: An apparatus for soldering/unsoldering SMD components comprising a heating nozzle which both permits direct heating of the component by contact with a hot nozzle bottom and directs a stream of hot gas onto the leads of the components. The nozzle bottom is preferably made of highly thermoconductive material and the hot gas stream is directed onto the leads by means of at least one outlet slot in the nozzle bottom adjacent the nozzle wall. The nozzle further comprises a centered suction means for positioning/removing the component.