Abstract: A method and a device for transporting and driving components and tools, such as rotors and stators for manufacture, includes a component carrier with at least two chain sprockets rigidly connected to the component carrier. The chain sprockets engage four driven chains to move, rotate and swivel or rotated to a limited extent the component carrier. With the upper chain and lower chain moving at the same speed and in opposite directions of movement, the component carrier rotates on the spot, with the two chains moving at the same speed and in the same direction of movement, the component carrier moves without rotation at the chain speed in the direction of movement, and with the chains moving at different speeds and in the same or different directions of movement, a plurality of combinations of direction of rotation, direction of movement, transport speed and rotational speed can be achieved.

Abstract: To improve the bonding layer for connecting wires to semiconductor chips with contact fingers, or contact strips, on a substrate carrier, the bonding layer is formed as spongy, microporous structure, applied to discrete positions of the contact strips by screen printing, and secured to the metallic connecting strip by a diffusion zone. Preferably, the bonding layer comprises a metal of gold, palladium, silver, aluminum and copper, or an alloy of at least two of these metals, or a base alloy of one of these metals, for example gold applied as a gold paste having an average grain size of less than 5 micro-meters, the layer being between 2 to 30 micrometers thick, preferably 3 to 10 micrometers. The metal is part of a paste of the metal in an evaporative organic carrier. After screen printing, the carrier is eliminated by heating; subsequent heating converts the metal to a spongy microporous structure bonded to the substrate carrier by a diffusion zone.

Abstract: To improve the bonding layer for connecting wires to semiconductor chips with contact fingers, or contact strips, on the carrier, the bonding layer is formed as spongy, microporous structure, applied to discrete positions of the contact strips by screen printing, and secured to the metallic connecting strip by a diffusion zone. Preferably, the bonding layer comprises a metal of gold, palladium, silver, aluminum and copper, or an alloy of at least two of these metals, or a base alloy of one of those metals, for example gold applied as a gold paste having an average grain size of less than 5 micrometers, the layer being between 2 to 30 micrometers thick, preferably 3 to 10 micrometers.