Abstract: To facilitate a reliable detection of age-related damage or delamination on components the following is proposed: [i] within the scope of radiofrequency reflectometry, scanning a component by radiofrequency signal irradiation in the micrometer or millimeter wavelength range and by measuring at least one reflection signal, which was reflected at the component, in punctiform, one-dimensional or two-dimensional fashion for the purposes of generating at least one first radiofrequency image representation; [ii] scanning the component in direct time offset fashion with respect to the radiofrequency signal irradiation by a combination of ultrasonic signal irradiation and the radiofrequency signal irradiation in the micrometer or millimeter wavelength range and by measuring at least one further reflection signal, which was reflected at the component; and [iii] comparing the radiofrequency image representations generated based on the reflection signals, wherein determined changes in the radiofrequency image representa

Abstract: The disclosure specifies an arrangement including a circuit carrier board on which is mounted at least one electrical/electronic component. At least one heat pipe is formed in the circuit carrier board. The disclosure also specifies a power converter including the arrangement, and an aircraft including a power converter.

Abstract: The aircraft has at least one power electronics component and a cooling circuit for cooling the at least one power electronics component by means of a fluid, wherein the aircraft has temperature adjusting means which are designed and arranged to adjust a temperature of the cooling circuit as a function of a temperature in or on the aircraft or of a power loss.

Abstract: The present disclosure relates to power semiconductor modules. The teachings thereof may be embodied in modules with a power semiconductor component and methods, as well as a circuit arrangement. For example, a method may include: developing a thermal model of the power semiconductor module at a reference time point; establishing a reference temperature based on the thermal model; measuring a temperature-sensitive electrical parameter of the power semiconductor module during operation of the power semiconductor module; determining a current temperature from the measured temperature-sensitive electrical parameter of the power semiconductor module; calculating a temperature difference between the current temperature and the reference temperature; and determining a deterioration of the power semiconductor module based on the calculated temperature difference.

Abstract: The present disclosure relates to power semiconductor modules. The teachings thereof may be embodied in modules with a power semiconductor component and methods, as well as a circuit arrangement. For example, a method may include: developing a thermal model of the power semiconductor module at a reference time point; establishing a reference temperature based on the thermal model; measuring a temperature-sensitive electrical parameter of the power semiconductor module during operation of the power semiconductor module; determining a current temperature from the measured temperature-sensitive electrical parameter of the power semiconductor module; calculating a temperature difference between the current temperature and the reference temperature; and determining a deterioration of the power semiconductor module based on the calculated temperature difference.

Abstract: A cooling device for cooling an electronic component, such as a power semiconductor, includes a cooling body which can be thermally coupled to the component, at least one sonotrode element for generating ultrasonic waves having a predetermined wavelength directed towards the cooling body, and a resonance tube that is associated with the sonotrode element and that is arranged between the sonotrode element and the cooling body, wherein a distance between the sonotrode element and the cooling body corresponds to an integral multiple of a quarter of a wavelength, such that a standing wave is formed between the at least one sonotrode element and the cooling body.

Abstract: A lighting device (1) comprising at least one light source (5), at least one base (7) thermally and electrically operationally connected to the light source (5), and at least one bulb fitting (10, 27) provided for receiving the base (7). The base (7) has at least one first heat transfer surface (15) and the bulb fitting (10, 27) has at least one second heat transfer surface (17) in contact with the first heat transfer surface (15) either directly or by way of a foil (16). At least one device (14, 26, 32, 39) is provided for exerting a predefined press force between the first heat transfer surface (15) and the second heat transfer surface (17).

Abstract: A lighting device (1) comprising at least one light source (5), at least one base (7) thermally and electrically operationally connected to the light source (5), and at least one bulb fitting (10, 27) provided for receiving the base (7). The base (7) has at least one first heat transfer surface (15) and the bulb fitting (10, 27) has at least one second heat transfer surface (17) in contact with the first heat transfer surface (15) either directly or by way of a foil (16). At least one device (14, 26, 32, 39) is provided for exerting a predefined press force between the first heat transfer surface (15) and the second heat transfer surface (17).

Abstract: A motor vehicle headlight comprising an illuminating device (3) which comprises at least one light-emitting diode chip (20). The motor vehicle headlight furthermore has a heat pipe (5) or a thermosiphon (35) with an evaporation region (6) and a condensation region (7), wherein the evaporation region (6) is thermally connected to the illuminating device (3), and the condensation region (7) is connected to a heat sink (8) which outputs heat absorbed at the illuminating device (3) to the surrounding area.

Abstract: At least one electric component, such as a power semiconductor component, has at least a two-phase cooling device having at least one evaporator. The evaporator has a liquefier with a structured liquefier surface for evaporating a cooling fluid, formed by an electric connecting line making electrical contact with an electric contact face of the component. The connecting line cools the power semiconductor component and a module equipped therewith. Isothermal cooling with a low thermal loading of the power semiconductor component or of the module is possible by virtue of the two-phase cooling device acting as an evaporating bath cooling system. The device is applied in the planar contact-making technology with a large surface by providing an electric component with an electric contact face and producing the electric connecting line to the evaporator surface on the contact face of the component.

Abstract: A composite material and a base plate made of this composite material for mounting electrical components and for connecting these components to a cooling device is disclosed. In one embodiment, the composite material includes a matrix material and fibers embedded therein. The fibers have in this case an anisotropic, directionally optimized distribution in the matrix material, so that heat occurring in a locally confined area can be effectively distributed and dissipated. The material of the fibers includes SiC, highly graphitized carbon or diamond. The fibers are arranged in the matrix material in various fiber levels, the fibers in the upper fiber levels being oriented predominantly horizontally in relation to a reference area and the fibers in the lower fiber levels being oriented predominantly vertically in relation to the reference area.

Abstract: A composite material and a base plate made of this composite material for mounting electrical components and for connecting these components to a cooling device is disclosed. In one embodiment, the composite material includes a matrix material and fibers embedded therein. The fibers have in this case an anisotropic, directionally optimized distribution in the matrix material, so that heat occurring in a locally confined area can be effectively distributed and dissipated. The material of the fibers includes SiC, highly graphitized carbon or diamond. The fibers are arranged in the matrix material in various fiber levels, the fibers in the upper fiber levels being oriented predominantly horizontally in relation to a reference area and the fibers in the lower fiber levels being oriented predominantly vertically in relation to the reference area.