Abstract: A method for securing electronic components, in particular power semiconductor components such as diodes, transistors or thyristors, and connection elements, to a substrate by pressure sintering. The method includes: applying a pastelike layer, made up of a metal powder and a solvent, to a supporting film; drying the pastelike layer; applying at least one component to the dried layer; subjecting the at least one component, the supporting film and the dried layer to pressure, as a result of which the adhesive force between the layer and the component becomes greater than that between the layer and the supporting film; lifting off the at least one component, with the layer adhering to it, from the supporting film; positioning the component, with the layer adhering to it, to the substrate; and subjecting the substrate and the component to pressure, for connecting them by sintering.

Abstract: A method of attaching members is provided. In one aspect, the method includes placing a bonding material comprising at least one of silver micro particles)and silver nano particles on a surface of a first member; placing the first member with the surface of the first member having the bonding material thereon on a surface of a second member; heating the bonding material to a selected temperature while applying a selected pressure on at least one of the first member and second member for a selected time period to sinter the bonding material to attach the first member to the second member.

Abstract: A microtool for embossing structures into a substrate is fastened to an object, such as a press plate, by sintering, preferably pressure sintering. An insight underlying the invention is the fact that such a sintering or pressure sintering method provides a sufficiently reliable, strong, heat conducting and/or dimensionally stable connection, even for a hot embossing process, where at elevated temperatures, pressures of 10-300 bar and tensile forces of up to 100-200 bar may act upon the connection, and where a dimensional stability of down to the micrometer scale may be required. According to a preferred embodiment, the forming temperature of a pressure sintered connection equals the embossing temperature, i.e. the working temperature of the tool.

Abstract: A method for securing electronic components, in particular power semiconductor components such as diodes, transistors or thyristors, and connection elements, to a substrate by pressure sintering. The method includes: applying a pastelike layer, made up of a metal powder and a solvent, to a supporting film; drying the pastelike layer; applying at least one component to the dried layer; subjecting the at least one component, the supporting film and the dried layer to pressure, as a result of which the adhesive force between the layer and the component becomes greater than that between the layer and the supporting film; lifting off the at least one component, with the layer adhering to it, from the supporting film; positioning the component, with the layer adhering to it, to the substrate; and subjecting the substrate and the component to pressure, for connecting them by sintering.

Abstract: An electronic power module includes at least one electronic power device, a DCB ceramic substrate, a heat sink and at least one additional thermal capacitance. The electronic power devices are connected by a sintered layer on their underside to an upper copper layer of the DCB ceramic substrate. The upper copper layer of the DCB ceramic substrate is structured into copper conductor tracks for electrically contacting the power devices. The lower copper layer of the DCB ceramic substrate is connected by a sintered layer to a heat sink. The upper sides of the power devices are connected by a sintered layer to an addition thermal capacitance.

Abstract: An electronic power module according to the invention comprises at least one electronic power device, a DCB ceramic substrate, a heat sink and at least one additional thermal capacitance,