Abstract: Powder compositions and articles and methods of forming articles from powder compositions are provided. The powder compositions include at least one powder that preferably includes an amount of one or more branched polymers such as, for example, one or more branched polyamide polymers. The powder composition is preferably capable of being formed, via a layer-by-layer sintering process such as, for example, selective laser sintering, into a three-dimensional article.

Abstract: Copolyamides, consisting of polycondensation products of the following components: caprolactam 10 to 45 mol-%, laurolactam 30 to 55 mol-%, at least 2 dicarboxylic acids 20 to 50 mol-% of the following compounds, aliphatic &agr;,&ohgr;-dicarboxylic acids with 6 up to 14 C atoms inclusively, terephthalic acid, isophthalic acid and 2,6-naphthalene dicarboxylic acid, wherein the content of aromatic dicarboxylic acids is lower than 10 mol-%, with reference to the allover amount of the above-mentioned components, which add up to 100 mol-%, a diamine mixture in an amount that is equimolar to that of the dicarboxylic acids, chosen from the group of the following substances, hexamethylene diamine, piperazine and/or 2-methyl-1,5-diaminopentane, wherein the molar content of hexa-methylene diamine is between 75 and 95 mol-% with reference to the diamine mixture. The copolyamides according to the invention are used for the production of mono- and multifilaments, fibers, films and nets.

Abstract: The invention relates to a method for production of a wash-resistant bond between a film on basis of copolyetherester waterproof and permeable to water vapor and at least one substrate on basis of polyester which is a woven or knitted fabric to achieve a pure bonded fabric having good wash resistance at 60° C., wherein said film on basis of copolyetherester which is waterproof and permeable to water vapor is manufactured with at least one film of a hot-melt adhesive on basis of a hydrophilic copolyetherester to a laminate previously before being bonded to said substrate by means of a hot-melt adhesive on basis of copolyester.

Abstract: Copolyamides, consisting of polycondensation products of the following components: caprolactam 10 to 45 mol-%, laurolactam 30 to 55 mol-%, at least 2 dicarboxylic acids 20 to 50 mol-% of the following compounds, aliphatic &agr;,&ohgr;-dicarboxylic acids with 6 up to 14 C atoms inclusively, terephthalic acid, isophthalic acid and 2,6-naphthalene dicarboxylic acid, wherein the content of aromatic dicarboxylic acids is lower than 10 mol-%, with reference to the allover amount of the above-mentioned components, which add up to 100 mol-%, a diamine mixture in an amount that is equimolar to that of the dicarboxylic acids, chosen from the group of the following substances, hexamethylene diamine, piperazine and/or 2-methyl- 1,5-diaminopentane, wherein the molar content of hexa-methylene diamine is between 75 and 95 mol-% with reference to the diamine mixture.

Abstract: The invention relates to novel hot-melt masses consisting of a statistically built-up copolyether ester based on terephthalic acid and a mixture of aliphatic diols. Terephthalic acid is used as the single acid component and its molar amount, relative to the total amount of acid, is 100 molar %. A combination of butane diol, diethylene glycol, polyethylene and optionally triethylene glycol is present as diol component. The molar amount of butane diol is less than 75 molar %, the amount of diethylene glycol is between 5 and 60 molar %, the amount of triethylene glycol between 0 and 40 molar % and at least 2 and at the most 10 molar % of a higher-molecular polyethylene glycol component with a molar mass of 600-4000 g/mole is used, relative to the total acid amount and total diol amount of 100 molar % in each instance. The melting point of the copolyether ester adhesive masses is between 90.degree. and 190.degree. C.

Abstract: The invention relates to novel hot-melt masses consisting of a statistically built-up copolyether ester based on terephthalic acid in a mixture of aliphatic diols. Terephthalic acid is used as the single acid component and its molar amount, relative to the total amount of acid, is 100 molar %. A combination of butane diol, triethylene glycol and polyethylene glycol is present as diol component. The molar amount of butane diol is less than 80 molar %, the amount of triethylene glycol is between 15 and 60 molar % and at least 2 and at the most 10 molar % of a higher-molecular polyethylene glycol component with a molar mass of 600-4000 g/mole is used, relative to the total acid amount and total diol amount of 100 molar % in each instance. The melting point of the copolyether ester adhesive masses is between 90.degree. and 180.degree. C. The copolyetherester hot-melt masses can be used in the hot-melt method and for other known powder coating methods.

Abstract: Hot-melt adhesives are based on a random copolyetherester formed from aromatic dicarboxylic acids, terephthalic acid and isophthalic acid wherein the molar proportion of terephthalic acid is at least 55% based on the acid content, with a butanediol content between 20 and 85 mol % and containing at least 10 mol % triethylene glycol; the remainder of the diol content is preferably diethylene glycol. Copolyetheresters of this type are distinguished by excellent adhesion properties, a low melting point, rapid crystallization, and good resistance to laundering and dry cleaning at a minimum viscosity of 80 Pas.