Abstract: The procedure for producing a screening profile of a resilient and electrically conductive sealing material for a housing (5), which is intended to receive electrical function elements, is as follows: In a first step of the method, the sealing material (4) is introduced into the groove-shaped mold cavity (2) of a negative mold (1). The course and the cross-section of the mold cavity (2) correspond to the course and the cross-section of the screening profile to be produced. The sealing material (4) initially protrudes somewhat above the mold cavity (2). If, in a second step of the method, the housing (5) to be provided with the screening profile is now placed in an appropriate position on the negative mold (1), those faces of the housing (5) which are to be provided with the screening profile contact the protruding region of the sealing material (4), pressing it back into the mold cavity (2) accordingly.

Abstract: The provision of a supplementary layer of nickel by an electroless process in order to provide solder wetting capability for a tempered aluminum-nickel metallization is made unnecessary by causing the layer of nickel deposited on an underlying aluminum metallization layer to have a thickness between 0.6 and 1.0 .mu.m and by conducting the subsequent tempering operation between 400 and 480.degree. C, preferably 475.degree. C, for a period of between 10 and 20 minutes, preferably 15 minutes. In order to provide high transverse conductivity, the aluminum layer should have a thickness between 3 and 10 .mu.m. The process is useful in the manufacture of semiconductor devices as well as for making electrical devices based on an insulating substrate.