Abstract: A molding system is provided, which includes at least one mold part and a heating and cooling module. The at least one mold part defines a mold cavity having an opening. The heating and cooling module is inserted into the opening to close the mold cavity. The heating and cooling module includes a die insert defining a mold surface, a layered heater for heating the mold surface, and a cooling unit for cooling the mold surface. The layered heater is disposed between the die insert and the cooling unit and includes functional layers formed directly on a surface of the cooling unit or a surface of the die insert opposite to the mold surface by using layered or layering processes selected from a group consisting of thick film, thin film, thermal spray and sol-gel processes.

Abstract: A method of manufacturing a layered heater includes: applying a dielectric material on a substrate to form a dielectric layer; thermal-spraying a resistive material on the dielectric layer to form a resistive layer on the dielectric layer; forming a plurality of conductive overlays at predetermined locations on the substrate; and forming a plurality of cuts into the resistive layer by laser cutting to form a resistive circuit pattern that overlaps the conductive overlays.

Abstract: A layered heater includes a resistive layer formed from a conductive material and separated into an intermediate area and a resistive circuit pattern by a plurality of cuts that extend all the way through the resistive layer. The resistive circuit pattern includes termination pads electrically connected to the resistive circuit pattern with the intermediate area being electrically inactive. A conductive overlay is disposed over a continuous portion of the resistive circuit pattern. The plurality of cuts extend longitudinally into the conductive overlay such that no portion of the resistive pattern is present outside the conductive overlay.

Abstract: A method of forming a layered heater assembly includes: forming a plurality of layers onto a substrate, the plurality of layers including a resistive element layer; forming electrical terminations in contact with the resistive element layer; securing a protective cover over the layers using a laser welding process, wherein edges of the protective cover are welded circumferentially around raised end portions of the substrate and welded longitudinally along a slotted portion of the substrate; securing a pair of lead wires to the electrical terminations; and securing a lead cap assembly around the pair of lead wires and to the protective cover using a laser welding process.

Abstract: A layered heater includes a resistive layer formed from a conductive material and separated into an intermediate area and a resistive circuit pattern by a plurality of cuts that extend all the way through the resistive layer. The resistive circuit pattern includes termination pads electrically connected to the resistive circuit pattern with the intermediate area being electrically inactive. A conductive overlay is disposed over a continuous portion of the resistive circuit pattern. The plurality of cuts extend longitudinally into the conductive overlay such that no portion of the resistive pattern is present outside the conductive overlay.

Abstract: A layered heater includes a resistive layer defining a resistive circuit pattern having at least one bend portion. A conductive overlay is provided on at least one of a top surface and a bottom surface of the bend portion to alleviate the current crowding effect, thereby protecting the electric circuit from premature failure. Methods of manufacturing the layered heater are also disclosed. The overlay may be formed on the bend portion after the resistive layer is formed. The overlay may also be formed on a substrate or a dielectric layer that supports the resistive layer before the resistive layer is formed.

Abstract: A heater assembly is provided that includes a substrate having opposed end portions defining raised flanges, a slot extending between the opposed end portions, and opposed chamfered surfaces extending along the slot and across the raised flanges. A plurality of layers are disposed onto the substrate, along with a pair of terminal pads. A protective cover defining at least one aperture is disposed over the layers and is secured to the raised flanges and the opposed chamfered surfaces of the substrate, and the aperture is disposed proximate the terminal pads. A pair of lead wires is secured to the pair of terminal pads, and a lead cap assembly is disposed around the pair of lead wires and is secured to the protective cover.

Abstract: A method of manufacturing a layered heater includes: applying a dielectric material on a substrate to form a dielectric layer; thermal-spraying a resistive material on the dielectric layer to form a resistive layer on the dielectric layer; forming a plurality of conductive overlays at predetermined locations on the substrate; and forming a plurality of cuts into the resistive layer by laser cutting to form a resistive circuit pattern that overlaps the conductive overlays.

Abstract: An electrical heating device for medical equipment is provided. The heating device includes a body, which may be an insulating body forming a channel therethrough for fluid travel, an insulating material surrounding the body, and a heater surrounding the body and the insulating material. In other forms, the electrical heating device for medical equipment has a conducting body, instead of an insulating body, forming a channel therethrough for fluid travel. A base dielectric layer is disposed on the conducting body, and a heater surrounds the base dielectric layer and the conducting body. A top dielectric layer is disposed on the heater, and a protection housing surrounds the top dielectric layer.

Abstract: A method of forming a layered heater assembly includes: forming a plurality of layers onto a substrate, the plurality of layers including a resistive element layer; forming electrical terminations in contact with the resistive element layer; securing a protective cover over the layers using a laser welding process, wherein edges of the protective cover are welded circumferentially around raised end portions of the substrate and welded longitudinally along a slotted portion of the substrate; securing a pair of lead wires to the electrical terminations; and securing a lead cap assembly around the pair of lead wires and to the protective cover using a laser welding process.

Abstract: A layered heater includes a resistive layer defining a resistive circuit pattern having at least one bend portion. A conductive overlay is provided on at least one of a top surface and a bottom surface of the bend portion to alleviate the current crowding effect, thereby protecting the electric circuit from premature failure. Methods of manufacturing the layered heater are also disclosed. The overlay may be formed on the bend portion after the resistive layer is formed. The overlay may also be formed on a substrate or a dielectric layer that supports the resistive layer before the resistive layer is formed.

Abstract: A heater assembly is provided that includes a substrate having opposed end portions defining raised flanges, a slot extending between the opposed end portions, and opposed chamfered surfaces extending along the slot and across the raised flanges. In one form, a plurality of layers are disposed onto the substrate, along with a pair of terminal pads. A protective cover defining at least one aperture is disposed over the layers and is secured to the raised flanges and the opposed chamfered surfaces of the substrate, and the aperture is disposed proximate the terminal pads. A pair of lead wires is secured to the pair of terminal pads, and a lead cap assembly is disposed around the pair of lead wires and is secured to the protective cover. Methods of manufacturing the heater assembly are also provided in accordance with the present disclosure.

Abstract: An instrumented heater sleeve is provided that has a plurality of zones, a dielectric layer disposed over an outer surface of the sleeve, a resistive element layer disposed over the first dielectric layer, and a plurality of pairs of lead wires secured to a portion of the resistive element layer. Each pair of lead wires is connected to and corresponds with each of the zones and a protective layer is disposed over the dielectric layer. An amount of power is supplied to each of the zones and adjusted during a test run, or multiple test runs, to achieve a desired temperature profile along a heating target such as a hot runner nozzle. Methods of designing a hot runner nozzle heater using the instrumented heater sleeve are also provided.

Abstract: An electrical heating device for medical equipment is provided. The heating device includes a body, which may be an insulating body forming a channel therethrough for fluid travel, an insulating material surrounding the body, and a heater surrounding the body and the insulating material. In other forms, the electrical heating device for medical equipment has a conducting body, instead of an insulating body, forming a channel therethrough for fluid travel. A base dielectric layer is disposed on the conducting body, and a heater surrounds the base dielectric layer and the conducting body. A top dielectric layer is disposed on the heater, and a protection housing surrounds the top dielectric layer.

Abstract: A method of forming a layered heater includes forming a continuous resistive layer over a substrate, forming conductive overlays in predetermined areas of the resistive layer, and removing portions of the continuous resistive layer between the conductive overlays to form a plurality of single cuts extending between the conductive overlays. The single cuts extend through the continuous resistive layer between the conductive overlays and longitudinally into a portion of the corresponding conductive overlays. Preferably, the single cuts are formed using a laser.

Abstract: A heater assembly is provided that includes a substrate having opposed end portions defining raised flanges, a slot extending between the opposed end portions, and opposed chamfered surfaces extending along the slot and across the raised flanges. In one form, a plurality of layers are disposed onto the substrate, along with a pair of terminal pads. A protective cover defining at least one aperture is disposed over the layers and is secured to the raised flanges and the opposed chamfered surfaces of the substrate, and the aperture is disposed proximate the terminal pads. A pair of lead wires is secured to the pair of terminal pads, and a lead cap assembly is disposed around the pair of lead wires and is secured to the protective cover. Methods of manufacturing the heater assembly are also provided in accordance with the present disclosure.

Abstract: An instrumented heater sleeve is provided that has a plurality of zones, a dielectric layer disposed over an outer surface of the sleeve, a resistive element layer disposed over the first dielectric layer, and a plurality of pairs of lead wires secured to a portion of the resistive element layer. Each pair of lead wires is connected to and corresponds with each of the zones and a protective layer is disposed over the dielectric layer. An amount of power is supplied to each of the zones and adjusted during a test run, or multiple test runs, to achieve a desired temperature profile along a heating target such as a hot runner nozzle. Methods of designing a hot runner nozzle heater using the instrumented heater sleeve are also provided.

Abstract: A layered heater includes a resistive layer defining a resistive circuit pattern having at least one bend portion. A conductive overlay is provided on at least one of a top surface and a bottom surface of the bend portion to alleviate the current crowding effect, thereby protecting the electric circuit from premature failure. Methods of manufacturing the layered heater are also disclosed. The overlay may be formed on the bend portion after the resistive layer is formed. The overlay may also be formed on a substrate or a dielectric layer that supports the resistive layer before the resistive layer is formed.

Abstract: A hot runner nozzle heater is provided that includes a sleeve defining a slot extending along a length of the sleeve. A first dielectric layer is disposed over an outer surface of the sleeve, and a resistive element layer is disposed over the first dielectric layer, wherein the resistive element layer defines a resistive circuit pattern that is preferably formed by a laser trimming process. A pair of terminal leads are secured to a portion of the resistive element layer thus defining a termination area, and the termination area is positioned proximate the slot and away from the proximal end and the distal end of the sleeve. A second dielectric layer is disposed over the resistive element layer but not over the termination area, a third dielectric layer is disposed over the termination area, and a protective layer disposed over the second dielectric layer and the third dielectric layer.

Abstract: A tool for removing a split-sleeve heater from a target object, such as a hot runner nozzle body, is provided that includes a handle, a shaft extending from the handle, and a protrusion disposed around at least a portion of a distal end portion of the shaft. The protrusion defines a shoulder, and the shoulder is adapted to engage a removal feature of the split-sleeve heater. In another form, a split-sleeve heater is provided that includes a heater body having opposed ends and a slot extending between the opposed ends. A recess is formed conjointly with the slot proximate at least one of the opposed ends, which is adapted for engagement by a removal tool. Methods of operating the tool and forming the slot of the split-sleeve heater are also provided.