Abstract: According to the present invention there is provided assemblies for treating polluted water, the assemblies comprising, a vessel which defines a volume in which said polluted water can be located; piezoelectric element located within said volume; a means for straining the piezoelectric element so as to generate transient electric charges on a surface of said piezoelectric element so that said generated transient electric charges cause redox reactions which degrade pollutants in the polluted water. There is further provided corresponding methods for treating polluted water.

Abstract: The tailorable light-emitting panel contains smallest sub-units connected in parallel with, in each case, at least two light-emitting bodies connected in series and operable by way of electricity, for example light-emitting diodes (24). The light-emitting panel may later be severed into part pieces capable of functioning per se, with at least the size of a smallest sub-unit. The panel includes an electrically conducting base layer (21) and a cover layer (29) electrically insulated from the base layer. The, base layer (21) and the cover layer (29) function as connection surfaces for the electrical parallel contacting of the sub-units. Conductor paths (23) electrically insulated from the electrical connection surfaces serve for the electrical connection of the various light-emitting bodies (24) of the sub-units.

Abstract: The tailorable light-emitting panel contains smallest sub-units connected in parallel with, in each case, at least two light-emitting bodies connected in series and operable by way of electricity, for example light-emitting diodes (24). The light-emitting panel may later be severed into part pieces capable of functioning per se, with at least the size of a smallest sub-unit. The panel includes an electrically conducting base layer (21) and a cover layer (29) electrically insulated from the base layer. The, base layer (21) and the cover layer (29) function as connection surfaces for the electrical parallel contacting of the sub-units. Conductor paths (23) electrically insulated from the electrical connection surfaces serve for the electrical connection of the various light-emitting bodies (24) of the sub-units.

Abstract: The invention is related to a multi-chip-module and to a method for its manufacture. The module comprises a base carrier, on which at least in some areas signal conductor tracks and signal contact surfaces arranged at least in a single layer are located, and with at least one semiconductor component operating in the signal range and connected with the signal conductor track and signal contact surfaces. The purpose is to achieve a high degree of integration with a multi-chip-module of this type. To do so, in addition at least in some areas on the base carrier power conductor tracks and power contact surfaces arranged in at least one layer are located. Furthermore, at least one power electronics component operating in the power range is provided, which is connected with at least one power conductor track, at least one power contact surface and at least one signal conductor track.