Abstract: An apparatus and a process for bonding a cardboard blank which has been coated or laminated with a plastic film, and particularly for hinge-lid packets such as cigarette packets on a continuously operated packing machine. The plastic film and a portion of the underlying cardboard material are first treated to expose a more suitable surface for bonding. Preferably, such treatment is by contacting with an apparatus which penetrates the plastic coating and creates depressions in the underlying cardboard. Subsequently, an adhesive is applied to the treated surface. The treated surface is compressed with the complementary area of the cardboard blank to be bonded. The apparatus of the invention comprises a heatable member whose contact surface may be comprised several rows of juxtaposed points or tips which may be approximately 1 to 5 mm in height.