Abstract: A Fresnel projection lens for a headlight of a motor vehicle having a light entry surface, wherein the light entry surface has a smooth or substantially smooth surface, and with a light exit surface. The light exit surface has a plurality of adjacent, in particular annular, flanks, wherein one flank each comprises a bottom, an effective facet, and an interfering facet arranged at a first pitch angle to the effective facet. The effective facet and the interfering facet form a cut edge opposite the bottom. A pass-through area is provided on at least one of the flanks, wherein the pass-through area is angled to the effective facet.

Abstract: The invention relates to a method for dry chemical treatment of substrates selected from the group comprising silicon, ceramic, glass, and quartz glass, in which the substrate is treated in a heated reaction chamber with a gas which contains hydrogen chloride as etching agent, and also to a substrate which can be produced in this way. The invention likewise relates to uses of the previously mentioned method.

Abstract: The invention relates to a method for dry chemical treatment of substrates selected from the group comprising silicon, ceramic, glass, and quartz glass, in which the substrate is treated in a heated reaction chamber with a gas which contains hydrogen chloride as etching agent, and also to a substrate which can be produced in this way. The invention likewise relates to uses of the previously mentioned method.

Abstract: A process and an apparatus used to subdivide objects (4) into slices, in particular to manufacture wafers from semi-conducting monocrystalline blocks, wherein these blocks are subdivided into slices with the help of at least one cutting tool (3), and under the influence of an etchant. Prior to completely cutting and subdividing the object (4) (ingot) into individual slices (wafers), a separating foil (12) is introduced into each cut slit (9) to separate the slices. This efficiently prevents the resultant wafers from sticking together. The individual separation of the wafers is thus accomplished right when the cutting process takes place so that the necessary number of process steps to manufacture silicon wafers is reduced.

Abstract: A process and an apparatus used to subdivide objects (4) into slices, in particular to manufacture wafers from semi-conducting monocrystalline blocks, wherein these blocks are subdivided into slices with the help of at least one cutting tool (3), and under the influence of an etchant. Prior to completely cutting and subdividing the object (4) (ingot) into individual slices (wafers), a separating foil (12) is introduced into each cut slit (9) to separate the slices. This efficiently prevents the resultant wafers from sticking together. The individual separation of the wafers is thus accomplished right when the cutting process takes place so that the necessary number of process steps to manufacture silicon wafers is reduced.

Abstract: The invention relates to a solar cell arrangement consisting of series-connected solar subcells. Said solar subcells consist of a semiconductor wafer which forms a common base material for all of the solar subcells and wherein a number of recesses are provided for delimiting the individual, series-connected solar subcells. The invention is characterised in that at least some of the recesses extend from the top surface of the semiconductor wafer, through the wafer itself to the bottom surface and in that at most some bridge segments are left in continuation of the recesses as far as the wafer edge, to mechanically interconnect the solar subcells.

Abstract: A solar cell comprising a substrate on which grooves are formed on the from and back sides thereof. The grooves on the front side are disposed in order to inscribe an angle with respect to the grooves on the back side. The intersection of the grooves on the from side and the back side form a plurality of through holes which form a grid pattern. Also disclosed is a method for producing a flat component with a grid of through holes (7). To produce the through holes (7), a plurality of generally equidistant, parallel V-shaped grooves (8) are formed on the from and back sides of a wafer. The grooves (8) on the two sides inscribe an angle relative to one another and are sufficiently deep for the through holes (7) to be automatically created at the intersections of grooves (8). The method is suitable for producing high efficiency solar cells.