Patents by Inventor Germar Schneider

Germar Schneider has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20230373092
    Abstract: A method of detecting and tracking human activities in the vicinity of a robot comprises the step of combining one or more two-dimensional images obtained from a time-of-flight (ToF) sensor with contemporaneously obtained data from a radar sensor, to obtain fused sensor data, and further comprises detecting the presence of a human in the vicinity of the robot, based on the fused sensor data, and estimating direction of motion and speed of motion of the human, based on the fused sensor data.
    Type: Application
    Filed: May 23, 2022
    Publication date: November 23, 2023
    Inventors: Feryel Zoghlami, Harald Heinrich, Germar Schneider, Okan Kamil Sen
  • Patent number: 11594439
    Abstract: According to various embodiments, a frame cassette includes a housing and a mounting structure within the housing. The mounting structure includes a plurality of tape-frame slots, each tape-frame slot configured to receive a tape-frame. The housing includes an opening configured to introduce a tape-frame into a tape-frame slot of the plurality of tape-frame slots, or to remove the tape frame from the tape-frame slot of the plurality of tape-frame slots. The housing also includes an electrostatic discharge protection. A corresponding automatic transportation system and method of automatic transportation of semiconductor wafers is also provided.
    Type: Grant
    Filed: June 15, 2018
    Date of Patent: February 28, 2023
    Assignee: Infineon Technologies AG
    Inventors: Germar Schneider, Matthias Taubert, Michael Mitrach, Thomas Gadau, Markus Pfeifenberger, Walter Leitgeb, Frank Boenewitz
  • Publication number: 20180308721
    Abstract: According to various embodiments, a frame cassette includes a housing and a mounting structure within the housing. The mounting structure includes a plurality of tape-frame slots, each tape-frame slot configured to receive a tape-frame. The housing includes an opening configured to introduce a tape-frame into a tape-frame slot of the plurality of tape-frame slots, or to remove the tape frame from the tape-frame slot of the plurality of tape-frame slots. The housing also includes an electrostatic discharge protection. A corresponding automatic transportation system and method of automatic transportation of semiconductor wafers is also provided.
    Type: Application
    Filed: June 15, 2018
    Publication date: October 25, 2018
    Inventors: Germar Schneider, Matthias Taubert, Michael Mitrach, Thomas Gadau, Markus Pfeifenberger, Walter Leitgeb, Frank Boenewitz
  • Patent number: 10020215
    Abstract: According to various embodiments, a frame cassette may include: a housing; a mounting structure inserted in the housing, the mounting structure including a plurality of tape-frame slots, wherein each tape-frame slot is configured to receive a tape-frame, wherein the housing includes an opening to introduce a tape-frame into a tape-frame slot of the plurality of tape-frame slots or to remove a tape-frame from a tape-frame slot of the plurality of tape-frame slots, and a door mounted at the housing, wherein the door is configured to close the opening of the housing to seal the interior of the housing from the exterior of the housing.
    Type: Grant
    Filed: January 26, 2016
    Date of Patent: July 10, 2018
    Assignee: Infineon Technologies AG
    Inventors: Germar Schneider, Matthias Taubert, Michael Mitrach, Thomas Gadau, Markus Pfeifenberger, Walter Leitgeb, Frank Boenewitz
  • Publication number: 20160141189
    Abstract: According to various embodiments, a frame cassette may include: a housing; a mounting structure inserted in the housing, the mounting structure including a plurality of tape-frame slots, wherein each tape-frame slot is configured to receive a tape-frame, wherein the housing includes an opening to introduce a tape-frame into a tape-frame slot of the plurality of tape-frame slots or to remove a tape-frame from a tape-frame slot of the plurality of tape-frame slots, and a door mounted at the housing, wherein the door is configured to close the opening of the housing to seal the interior of the housing from the exterior of the housing.
    Type: Application
    Filed: January 26, 2016
    Publication date: May 19, 2016
    Inventors: Germar Schneider, Matthias Taubert, Michael Mitrach, Thomas Gadau, Markus Pfeifenberger, Walter Leitgeb, Frank Boenewitz
  • Publication number: 20150214084
    Abstract: According to various embodiments, a frame cassette may include: a housing; a mounting structure inserted in the housing, the mounting structure including a plurality of tape-frame slots, wherein each tape-frame slot is configured to receive a tape-frame, wherein the housing includes an opening to introduce a tape-frame into a tape-frame slot of the plurality of tape-frame slots or to remove a tape-frame from a tape-frame slot of the plurality of tape-frame slots, and a door mounted at the housing, wherein the door is configured to close the opening of the housing to seal the interior of the housing from the exterior of the housing.
    Type: Application
    Filed: January 30, 2014
    Publication date: July 30, 2015
    Applicant: Infineon Technologies AG
    Inventors: Germar Schneider, Matthias Taubert, Michael Mitrach, Thomas Gadau, Markus Pfeifenberger, Walter Leitgeb, Frank Boenewitz
  • Patent number: 7802830
    Abstract: A method and apparatus for handling an article in semiconductor fabrication in which the article is completely separated from a gripper by a frozen liquid. The gripper includes a feeding device for introducing a liquid such as a high-purity water or a decontaminating liquid. The gripper also includes a cooling device for freezing the liquid. A suction take-in device applies negative pressure to hold the article against the frozen liquid.
    Type: Grant
    Filed: August 14, 2007
    Date of Patent: September 28, 2010
    Assignee: Qimonda AG
    Inventors: Gerd Brueckner, Arthur Deutschlaender, Harald Heinrich, Germar Schneider, Steffen Schroeder
  • Publication number: 20080038904
    Abstract: The invention relates inter alia to a method and apparatus for handling an article in semiconductor fabrication. For example, the method includes handling the article by completely separating the article from a gripper by a frozen liquid.
    Type: Application
    Filed: August 14, 2007
    Publication date: February 14, 2008
    Inventors: Gerd Brueckner, Arthur Deutschlaender, Harald Heinrich, Germar Schneider, Steffen Schroeder
  • Patent number: 6995091
    Abstract: The invention relates to a process for chemically mechanically polishing and grinding wafers. The CMP slurry that is used for grinding is analyzed using slurry atomic absorption spectroscopy. This allows rapid and sensitive analysis of the slurry constituents, in particular of interfering ions. The process can be automated and makes it possible to process wafers with a constant quality. Furthermore, rapid fault analysis or optimization of the process parameters used during the grinding is possible.
    Type: Grant
    Filed: November 25, 2002
    Date of Patent: February 7, 2006
    Assignee: Infineon Technologies AG
    Inventor: Germar Schneider
  • Publication number: 20030100144
    Abstract: The invention relates to a process for chemically mechanically polishing and grinding wafers. The CMP slurry that is used for grinding is analyzed using slurry atomic absorption spectroscopy. This allows rapid and sensitive analysis of the slurry constituents, in particular of interfering ions. The process can be automated and makes it possible to process wafers with a constant quality. Furthermore, rapid fault analysis or optimization of the process parameters used during the grinding is possible.
    Type: Application
    Filed: November 25, 2002
    Publication date: May 29, 2003
    Inventor: Germar Schneider
  • Patent number: 6443171
    Abstract: An exhaust apparatus for a treatment unit of electrical components, preferably wafers, particularly for a spray tool to clean electrical components, is described. To ensure that particles of a size greater than or equal to 0.16 &mgr;m in diameter can be reliably removed from the treatment unit, which particles would otherwise cause contamination of the electrical components, the exhaust apparatus is provided with a main exhaust pipe and a side pipe. The main exhaust pipe has an outside pipe and an inside pipe, whereby the inside pipe is equipped with a number of nozzles. The side pipe connects the treatment unit with the main exhaust pipe and which has an outside pipe and an inside pipe, whereby the inside pipe is equipped with a number of nozzles. The inside pipes are connected with a source of a cleaning fluid such that the cleaning fluid at least intermittently flows through the inside pipes for the purpose of rinsing.
    Type: Grant
    Filed: February 15, 2000
    Date of Patent: September 3, 2002
    Assignee: Infineon Technologies AG
    Inventors: Germar Schneider, Pierre-Louis Saez