Abstract: In accordance with an embodiment, a semiconductor device includes: an n-doped region disposed over an insulating layer; a p-doped region disposed over the insulating layer adjacent to the n-doped region, where an interface between the n-doped region and the p-doped region form a first diode junction; a plurality of segmented p-type anode regions disposed over the insulating layer, each of the plurality of segmented p-type anode regions being surrounded by the n-doped region, where a doping concentration of the plurality of segmented p-type anode regions is greater than a doping concentration of the p-doped region; and a plurality of segmented n-type cathode regions disposed over the insulating layer. Each of the plurality of segmented n-type cathode regions are surrounded by the p-doped region, where a doping concentration of the plurality of segmented n-type cathode regions is greater than a doping concentration of the n-doped region.

Abstract: An injection unit for a shaping machine includes an injection element suitable for introducing a plasticized material into a mold tool by a linear movement of the injection element. The injection element is coupled in linear motion-transmitting relationship to a bearing element, and at least two linear drives are adapted to exert a force on the injection element by the bearing element. The force can be transmitted by a transmission element from the at least two linear drives to the bearing element and thus to the injection element, and at least one clearance is arranged between the bearing element and the transmission element such that deformations of the bearing element are not transmitted to the transmission element or are transmitted to a reduced degree.

Abstract: An injection unit for a shaping machine includes an injection element suitable for introducing a plasticized material into a mould tool by a linear movement of the injection element. The injection element is coupled in linear motion-transmitting relationship to a bearing element, and at least two linear drives are adapted to exert a force on the injection element by the bearing element. The force can be transmitted by a transmission element from the at least two linear drives to the bearing element and thus to the injection element, and at least one clearance is arranged between the bearing element and the transmission element so that deformations of the bearing element are not transmitted to the transmission element or are transmitted to a reduced degree.