Patents by Inventor Gernot Gmunder

Gernot Gmunder has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Component Carrier Having at Least a Part Formed as a Three-Dimensionally Printed Structure Forming an Antenna
    Publication number: 20220190464
    Abstract: A component carrier and a method for manufacturing a component carrier are disclosed. The component carrier comprises a carrier body having a plurality of electrically conductive layer structures and/or electrically isolating layer structures and a three-dimensionally printed structure forming at least a part of an antenna on the carrier body.
    Type: Application
    Filed: March 4, 2022
    Publication date: June 16, 2022
    Inventors: Marco Gavagnin, Markus Leitgeb, Ahmad Bader Alothman Alterkawi, Ferdinand Lutschounig, Heinz Moitzi, Thomas Krivec, Gernot Grober, Erich Schlaffer, Mike Morianz, Rainer Frauwallner, Hubert Haidinger, Gernot Schulz, Gernot Gmunder
  • Package With Embedded Electronic Component Being Encapsulated in a Pressureless Way
    Publication number: 20200111717
    Abstract: A method of manufacturing an electronic package is disclosed. The described method includes (a) placing an electronic component on at least one layer structure; (b) encapsulating the electronic component by an encapsulant in a pressureless way; and (c) forming at least one further layer structure at the layer structure to thereby form a stack beneath the encapsulated electronic component. A further described electronic package includes (a) a stack comprising at least one layer structure and at least one further layer structure; (b) an electronic component being placed on the stack; and (c) an encapsulant encapsulating the electronic component, wherein the encapsulant has been formed in a pressureless way. Further described is an electronic device comprising such an electronic package.
    Type: Application
    Filed: October 2, 2019
    Publication date: April 9, 2020
    Inventors: Gernot Gmunder, Gernot Schulz
  • Component Carrier Having at Least a Part Formed as a Three-Dimensionally Printed Structure
    Publication number: 20190110366
    Abstract: A component carrier and a method for manufacturing a component carrier are described. The component carrier has a carrier body with a plurality of electrically conductive layer structures and/or electrically insulating layer structures. At least a part of the component carrier is formed as a three-dimensionally printed structure.
    Type: Application
    Filed: October 5, 2018
    Publication date: April 11, 2019
    Inventors: Marco Gavagnin, Markus Leitgeb, Jonathan Silvano de Sousa, Ferdinand Lutschounig, Heinz Moitzi, Thomas Krivec, Gernot Grober, Erich Schlaffer, Mike Morianz, Rainer Frauwallner, Hubert Haidinger, Gernot Schulz, Gernot Gmunder