Abstract: A method of manufacturing an electronic package is disclosed. The described method includes (a) placing an electronic component on at least one layer structure; (b) encapsulating the electronic component by an encapsulant in a pressureless way; and (c) forming at least one further layer structure at the layer structure to thereby form a stack beneath the encapsulated electronic component. A further described electronic package includes (a) a stack comprising at least one layer structure and at least one further layer structure; (b) an electronic component being placed on the stack; and (c) an encapsulant encapsulating the electronic component, wherein the encapsulant has been formed in a pressureless way. Further described is an electronic device comprising such an electronic package.

Abstract: In the case of a photovoltaic module which comprises a plurality of solar cells which are each coupled to an electrically conductive, structured layer for discharging the electrical energy generated in the solar cells, wherein at least two subregions of the photovoltaic module are coupled to one another via a flexible connecting region, provision is made for the solar cells to be coupled on the rear side of said solar cells to the electrically conductive, structured layer, and for the electrically conductive, structured layer to be integrated in a multilayered film arranged on the rear side of the solar cells, wherein the multilayered film forms the flexible connecting region between the at least two subregions of the photovoltaic module, as a result of which a photovoltaic module which can be tilted or folded can be made available.

Abstract: In a method and system consisting of a photovoltaic module and a connection housing or a junction box, wherein the photovoltaic module comprises at least one solar cell which is coupled at a rear side to an electrically conductive and structured layer for conducting away the electrical energy generated in a solar cell, and, furthermore, at least one transparent carrier layer and a covering layer are provided, wherein the electrically conducting layer can be contact-connected to connections of the connection housing, it is proposed that connections or connection elements of the connection housing can be coupled directly to partial regions having different polarities of the conducting layer via at least one through-opening in the covering layer, as a result of which contact-connection of a photovoltaic module to connection elements of a connection housing can be obtained in a simple and reliable manner.