Patents by Inventor Gernot Manfred Bauer

Gernot Manfred Bauer has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 12080454
    Abstract: An integrated circuit includes a thin film resistor body that is formed over a dielectric layer. An interfacial layer is formed on the thin film resistor body and resistor heads are formed on the interfacial layer. The thin film resistor body includes nickel chromium aluminum (NiCrAl) and the resistor heads include titanium tungsten (TiW).
    Type: Grant
    Filed: November 26, 2021
    Date of Patent: September 3, 2024
    Assignee: TEXAS INSTRUMENTS INCORPORATED
    Inventors: Gernot Manfred Bauer, Kai-Alexander Schachtschneider
  • Publication number: 20230170111
    Abstract: An integrated circuit includes a thin film resistor body that is formed over a dielectric layer. An interfacial layer is formed on the thin film resistor body and resistor heads are formed on the interfacial layer. The thin film resistor body includes nickel chromium aluminum (NiCrAl) and the resistor heads include titanium tungsten (TiW).
    Type: Application
    Filed: November 26, 2021
    Publication date: June 1, 2023
    Inventors: Gernot Manfred Bauer, Kai-Alexander Schachtschneider