Abstract: A circuit is disclosed. The circuit includes at least one nanostructure and a carbon interconnect formed by a substantially carbon layer, wherein the nanostructure and the carbon interconnect are directly coupled to one another.

Abstract: In a method for manufacturing a layer arrangement, a plurality of electrically conductive structures are embedded in a substrate. Material of the substrate is removed at least between adjacent electrically conductive structures. An interlayer is formed on at least one portion of sidewalls of each of the electrically conductive structures. A first layer is formed on the interlayer where an upper partial region of the interlayer remaining free of a covering with the first layer. An electrically insulating second layer is formed selectively on that partial region of the interlayer which is free of the first layer, in such a way that the electrically insulating second layer bridges adjacent electrically conductive structures such that air gaps are formed between adjacent electrically conductive structures.

Abstract: A memory includes a first memory device including an array of phase changing memory cells. The first memory device is of a first memory type. The integrated circuit includes a second memory device including an array of phase changing memory cells. The second memory device is of a second memory type that is different than the first memory type. The first and second memory devices are packaged together into a single memory device.

Abstract: A communication system is disclosed. In one embodiment, the communication system includes a communication device set up to execute a process, configured to put itself into an activated state or into a deactivated state at alternate times, receive time information in a first operating state of the activated state, take the received time information as a basis for ascertaining the later time at which useful information is transmitted to the communication device, receive the useful information at the later time in a second operating state of the activated state. Individual components of the communication device are able to be put into an activated state or into a deactivated state independently of one another.

Abstract: An integrated circuit includes an array of memory cells, and an error correction code circuit configured to correct errors in data read from the array based at least in part on a map that identifies locations of erratic memory cells in the array.

Abstract: An integrated circuit including a memory with an array of memory cells, each memory cell comprising a non-volatile memory element; and a limited read circuit communicatively coupled to the array of memory cells.

Abstract: A field effect transistor arrangement includes an electrically insulating layer, a source region, a drain region and a channel region arranged between source region and drain region, wherein the source region, the drain region and the channel region are in each case arranged on or above the electrically insulating layer, and also a gate region having an electrically insulating gate layer and an electrically conductive gate layer, which adjoins the channel region or is arranged at a distance from the latter and which extends at least partly along the channel region, wherein the source region and the drain region are in each case produced from electrically conductive carbon, and wherein the channel region is produced from strained silicon.

Abstract: A memory buffer comprises a first asynchronous latch chain interface connectable to at least one of a memory controller and a memory buffer, a second data interface connected to a memory device, and a circuit comprising a buffer and a processor, the circuit being coupled to the first and the second interfaces, so that data can be passed between the first interface and the buffer and between the second interface and the buffer and so that the processor is capable of processing at least one of the data from the first interface to the second interface and the data from the second interface according to a data processing functionality, wherein the data processing functionality of the processor is changeable by a programming signal received via an interface of a memory buffer.

Abstract: In a method for manufacturing a layer arrangement, a plurality of electrically conductive structures are embedded in a substrate. Material of the substrate is removed at least between adjacent electrically conductive structures. An interlayer is formed on at least one portion of sidewalls of each of the electrically conductive structures. A first layer is formed on the interlayer where an upper partial region of the interlayer remaining free of a covering with the first layer. An electrically insulating second layer is formed selectively on that partial region of the interlayer which is free of the first layer, in such a way that the electrically insulating second layer bridges adjacent electrically conductive structures such that air gaps are formed between adjacent electrically conductive structures.

Abstract: The invention relates to a bridge field-effect transistor storage cell comprising first and second source/drain areas and a channel area arranged therebetween, which are formed in a semiconductor bridge. The inventive storage cell also comprises a charge-coupled layer that is disposed at least partially on the semiconductor bridge and a metal conductive gate area on at least one part of the charge-coupled layer that is arranged in such a way that electric charge carriers are selectively introducible or removable by applying a predetermined electric voltage to the bridge field-effect transistor storage cell.

Abstract: The invention relates to a method for depositing a conductive carbon material (17) on a semiconductor (14) for forming a Schottky contact (16). The inventive method comprises the following steps: introducing a semiconductor (14) into a process chamber (10); heating the interior (10?) of a process chamber (10) to a defined temperature; evacuating the process chamber (10) to a first defined pressure or below; heating the interior (10?) of a process chamber (10) to a second defined temperature; introducing a gas (12) which comprises at least carbon, until a second defined pressure is achieved which is higher than the first defined pressure; and depositing the conductive carbon material (17) on the semiconductor (14) from the gas (12) which comprises at least carbon, whereby the deposited carbon material (17) forms the Schottky contact (16) on the semiconductor (14).

Abstract: A method of forming an ultrathin homogenous metal layer that serves as base metallization for formation of contact locations and/or contact pads and/or wirings of an integrated electronic component. The method includes the steps of depositing a first metal layer on a substrate at least in regions, and producing a second metal layer on the first metal layer at least in regions, component(s) of the second metal layer have a more positive redox potential than component(s) of the first metal layer, wherein ultrathin homogenous deposition of the second metal layer is effected by wet-chemical, current-free, electrochemical redox processes by element exchange from one or more metal salts as oxidant with at least a top metal atomic layer of the first metal layer as reductant.

Abstract: A process for the selective and areal deposition of a catalyst is disclosed, which is intended for the growth of nanotubes, on an interconnect line in an integrated circuit or chip. The process includes providing an acidic or alkaline aqueous solution of the catalyst; applying the solution to the interconnect line; and removing the excess solution.

Abstract: A method of forming an ultrathin homogenous metal layer that serves as base metallization for formation of contact locations and/or contact pads and/or wirings of an integrated electronic component. The method includes the steps of depositing a first metal layer on a substrate at least in regions, and producing a second metal layer on the first metal layer at least in regions, component(s) of the second metal layer have a more positive redox potential than component(s) of the first metal layer, wherein ultrathin homogenous deposition of the second metal layer is effected by wet-chemical, current-free, electrochemical redox processes by element exchange from one or more metal salts as oxidant with at least a top metal atomic layer of the first metal layer as reductant.