Abstract: A test apparatus for testing integrated modules has a plurality of connection locations on a carrier substrate. An integrated module may be connected, via a connection location, to a test unit connected to the carrier substrate. The connection locations are arranged in groups within a connection array. A control terminal via which an integrated module may be selected for a test can be provided for each connection location. An address and command terminal can be provided for each connection location. The modules of the number of groups, which are simultaneously operated, are connected to the address and command bus via the respective switching means or switch. The test frequency can thus be increased without adversely affecting the driver load.

Abstract: In a method for testing a plurality of devices, which are arranged on a wafer and connected to a common data line, wherein the devices are connectable to a test unit via the common data line, a connection is separated first between a defective device and the common data line, or an internal connection in the defective device is separated. Subsequently, the remaining devices are tested. Alternatively, instead of the connection between the defective device and the common data line, the connection between a defective device and a common or an individual supply line is separated.

Abstract: A test apparatus for testing integrated modules has a plurality of connection locations on a carrier substrate. An integrated module may be connected, via a connection location, to a test unit connected to the carrier substrate. The connection locations are arranged in groups within a connection array. A control terminal via which an integrated module may be selected for a test can be provided for each connection location. An address and command terminal can be provided for each connection location. The modules of the number of groups, which are simultaneously operated, are connected to the address and command bus via the respective switching means or switch. The test frequency can thus be increased without adversely affecting the driver load.

Abstract: A method for releasable contact-connection of a plurality of integrated semiconductor modules on a wafer, each of which having a plurality of interconnected supply voltage terminals, includes the steps of providing a contacting card for applying external electrical signals to the semiconductor modules with contact elements for releasable electrical connection to terminal pads of the semiconductor modules, aligning the contacting card with the wafer, producing a releasable contact between terminal pads of the plurality of semiconductor modules and the contact elements of the contacting card, checking the contact quality for each of the semiconductor modules by applying a voltage to at least one of the supply voltage terminals of the semiconductor module through the contacting card, measuring the voltage present at a further one of the supply voltage terminals through the contacting card, and using the measurement result to assess whether or not the semiconductor module has correct contact.

Abstract: In a method for testing a plurality of devices, which are arranged on a wafer and connected to a common data line, wherein the devices are connectable to a test unit via the common data line, a connection is separated first between a defective device and the common data line, or an internal connection in the defective device is separated. Subsequently, the remaining devices are tested. Alternatively, instead of the connection between the defective device and the common data line, the connection between a defective device and a common or an individual supply line is separated.

Abstract: A method for releasable contact-connection of a plurality of integrated semiconductor modules on a wafer, each of which having a plurality of interconnected supply voltage terminals, includes the steps of providing a contacting card for applying external electrical signals to the semiconductor modules with contact elements for releasable electrical connection to terminal pads of the semiconductor modules, aligning the contacting card with the wafer, producing a releasable contact between terminal pads of the plurality of semiconductor modules and the contact elements of the contacting card, checking the contact quality for each of the semiconductor modules by applying a voltage to at least one of the supply voltage terminals of the semiconductor module through the contacting card, measuring the voltage present at a further one of the supply voltage terminals through the contacting card, and using the measurement result to assess whether or not the semiconductor module has correct contact.