Abstract: An RF three-way combiner/splitter is disclosed that can be fabricated in a single signal layer on a PCB and which has better separation of the outputs and improved location of ballast resistors. The combiner/splitter includes seven one-quarter wave-length trace segments joined to form a structure in a general shape of a figure eight. The seven one-quarter wave-length trace segments connect to form six connection ports, wherein a first and second connection port is above and below a central input port and three output ports are disposed on the opposite side of the structure. A first ballast resistor is coupled to the first connection port and a second ballast resistor is coupled to the second connection port. The trace segments may be straight or some of the trace segments may be folded to decrease the physical length of the combiner/splitter.