Patents by Inventor Gerry Balanon
Gerry Balanon has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 7446408Abstract: A package is provided for a semiconductor device including a semiconductor device support substrate having at least one interconnect metal therein connectible to a ground and having at least one opening exposing the surface of the interconnect metal. A heat sink has elastic means integral therewith for cooperating with the opening to position and secure the heat sink to the semiconductor support substrate.Type: GrantFiled: June 16, 2003Date of Patent: November 4, 2008Assignee: ST Assembly Test Services Pte LtdInventors: Il Kwon Shim, Seng Guan Chow, Gerry Balanon
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Patent number: 6818981Abstract: A PBGA package is provided. The heat spreader interfaces with the substrate with the standoff of the heat spreader. The stand-off of the heat spreader is provided with an opening, the stand-off of the heat spreader is aligned with the substrate of the PBGA package by means of a copper pad that is provided over a second surface of the substrate. A solder bump is further provided over the surface of the copper pad. Thermally conductive solder is deposited over the opening of the heat spreader and over the copper pad. If the heat spreader stand-off is aligned with contact pads, thermally conductive epoxy is deposited over the contact pads.Type: GrantFiled: January 26, 2004Date of Patent: November 16, 2004Assignee: St Assembly Test Services PTE LTDInventors: Il Kwon Shim, Hermes T. Apale, Gerry Balanon
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Publication number: 20040155338Abstract: A new method is provided for the interface between a heat spreader and the substrate of a thermally improved PBGA package. The heat spreader interfaces with the substrate with the standoff of the heat spreader. The stand-off of the heat spreader is provided with an opening, the stand-off of the heat spreader is aligned with the substrate of the PBGA package by means of a copper pad that is provided over a second surface of the substrate. A gold stud bump or a solder bump are further provided over the surface of the copper pad for alignment purposes. Thermally conductive epoxy or solder is deposited over the opening of the heat spreader and therewith over the copper pad provided over a second surface of the substrate.Type: ApplicationFiled: January 26, 2004Publication date: August 12, 2004Inventors: Il Kwon Shim, Hermes T. Apale, Gerry Balanon
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Patent number: 6706563Abstract: A new method is provided for the interface between a heat spreader and the substrate of a thermally improved PBGA package. The heat spreader interfaces with the substrate with the standoff of the heat spreader. The stand-off of the heat spreader is provided with an opening, the stand-off of the heat spreader is aligned with the substrate of the PBGA package by means of a copper pad that is provided over a second surface of the substrate. A gold stud bump or a solder bump are further provided over the surface of the copper pad for alignment purposes. Thermally conductive epoxy or solder is deposited over the opening of the heat spreader and therewith over the copper pad provided over a second surface of the substrate.Type: GrantFiled: April 10, 2002Date of Patent: March 16, 2004Assignee: ST Assembly Test Services PTE LTDInventors: Il Kwon Shim, Hermes T. Apale, Gerry Balanon
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Publication number: 20030216024Abstract: In accordance with the objectives of the invention a new method is provided to position and secure a heat sink over the surface of a semiconductor device mounting support, the latter typically being referred to as a semiconductor substrate. A plurality of recesses is created in the surface of the substrate over which the heat sink is to be mounted. The heat sink is (conventionally and not part of the invention) provided with dimples that form the interface between the heat sink and the underlying substrate. The dimples of the heat sink are aligned with and inserted into the recesses that have been created by the invention in the underlying substrate for this purpose, firmly securing the heat sink in position with respect to the substrate.Type: ApplicationFiled: June 16, 2003Publication date: November 20, 2003Applicant: ST ASSEMBLY TEST SERVICES PTE LTDInventors: Il Kwon Shim, Seng Guan Chow, Gerry Balanon
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Publication number: 20030197195Abstract: A new method is provided for the interface between a heat spreader and the substrate of a thermally improved PBGA package. The heat spreader interfaces with the substrate with the standoff of the heat spreader. The stand-off of the heat spreader is provided with an opening, the stand-off of the heat spreader is aligned with the substrate of the PBGA package by means of a copper pad that is provided over a second surface of the substrate. A gold stud bump or a solder bump are further provided over the surface of the copper pad for alignment purposes. Thermally conductive epoxy or solder is deposited over the opening of the heat spreader and therewith over the copper pad provided over a second surface of the substrate.Type: ApplicationFiled: April 10, 2002Publication date: October 23, 2003Applicant: St Assembly Test Services Pte LtdInventors: Il Kwon Shim, Hermes T. Apale, Gerry Balanon
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Patent number: 6599779Abstract: In accordance with the objectives of the invention a new method is provided to position and secure a heat sink over the surface of a semiconductor device mounting support, the latter typically being referred to as a semiconductor substrate. A plurality of recesses is created in the surface of the substrate over which the heat sink is to be mounted. The heat sink is (conventionally and not part of the invention) provided with dimples that form the interface between the heat sink and the underlying substrate. The dimples of the heat sink are aligned with and inserted into the recesses that have been created by the invention in the underlying substrate for this purpose, firmly securing the heat sink in position with respect to the substrate.Type: GrantFiled: September 24, 2001Date of Patent: July 29, 2003Assignee: St Assembly Test Service Ltd.Inventors: Il Kwon Shim, Seng Guan Chow, Gerry Balanon
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Publication number: 20030057545Abstract: In accordance with the objectives of the invention a new method is provided to position and secure a heat sink over the surface of a semiconductor device mounting support, the latter typically being referred to as a semiconductor substrate. A plurality of recesses is created in the surface of the substrate over which the heat sink is to be mounted. The heat sink is (conventionally and not part of the invention) provided with dimples that form the interface between the heat sink and the underlying substrate. The dimples of the heat sink are aligned with and inserted into the recesses that have been created by the invention in the underlying substrate for this purpose, firmly securing the heat sink in position with respect to the substrate.Type: ApplicationFiled: September 24, 2001Publication date: March 27, 2003Applicant: St Assembly Test Services Pte LtdInventors: IL Kwon Shim, Seng Guan Chow, Gerry Balanon
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Patent number: 6534859Abstract: A new method and package is provided for face-up packaging of semiconductor devices. The semiconductor device is mounted over the surface of a semiconductor device support surface using conventional methods of device packaging up through device bond wire interconnect to electrical traces on the surface of the semiconductor device support surface over which the device is mounted. An internal mold cap is formed over the device, the internal mold cap has an opening exposing the surface of the device. An external mold cap is formed surrounding the internal mold cap with a cavity separating the external mold cap from the internal mold cap. Thermally conductive epoxy is deposited in the opening of the internal mold cap and in the cavity between the internal and the external mold cap. The heat spreader is placed and attached after which a thermal epoxy and mold cure is applied to the package.Type: GrantFiled: April 5, 2002Date of Patent: March 18, 2003Assignee: St. Assembly Test Services Ltd.Inventors: Il Kwon Shim, Seng Guan Chow, Gerry Balanon