Abstract: An electronic controller having a housing, and a lower sub-assembly connected to a housing through the use of a laser weld, eliminating the use of a gasket and fasteners. The laser weld provides a sealed connection between the housing and the lower sub-assembly, preventing debris, moisture, oils, ATF, and chemicals from entering the housing, which protects the electrical components located inside the housing. The elimination of the gasket and fasteners also reduces the cost of the electronic controller. Depending upon the application, the electrical components may be mounted directly to the lower sub-assembly, or the electrical components may be mounted on a metal core. The metal core is used to provide heat dissipation and function as an electrical conductor. The lower sub-assembly may either be overmolded around the metal core, or the metal core may be attached to the lower sub-assembly after the lower sub-assembly has been formed.

Abstract: An electronic controller having a housing, and a lower sub-assembly connected to a housing through the use of a laser weld, eliminating the use of a gasket and fasteners. The laser weld provides a sealed connection between the housing and the lower sub-assembly, preventing debris, moisture, oils, ATF, and chemicals from entering the housing, which protects the electrical components located inside the housing. The elimination of the gasket and fasteners also reduces the cost of the electronic controller. Depending upon the application, the electrical components may be mounted directly to the lower sub-assembly, or the electrical components may be mounted on a metal core. The metal core is used to provide heat dissipation and function as an electrical conductor. The lower sub-assembly may either be overmolded around the metal core, or the metal core may be attached to the lower sub-assembly after the lower sub-assembly has been formed.

Abstract: A system for dissipating heat from a semiconductor board includes a first substrate including an opening formed therein, a second substrate attached to a surface of the first substrate, and a microchip positioned in the opening and bumped to the second substrate. The system further includes a heat sink directly adhered to the microchip. A method of manufacturing a heat dissipating semiconductor board includes forming an opening in a first substrate and positioning a microchip in the opening. The method further includes directly adhering the microchip to a heat sink, bonding the microchip to a second substrate and boding a surface of the first substrate to the second substrate.

Abstract: A system for dissipating heat from a semiconductor board includes a first substrate including an opening formed therein, a second substrate attached to a surface of the first substrate, and a microchip positioned in the opening and bumped to the second substrate. The system further includes a heat sink directly adhered to the microchip. A method of manufacturing a heat dissipating semiconductor board includes forming an opening in a first substrate and positioning a microchip in the opening. The method further includes directly adhering the microchip to a heat sink, bonding the microchip to a second substrate and boding a surface of the first substrate to the second substrate.

Abstract: Disclosed is a mounting structure for mounting an IC on a substrate, and particularly useful in a Multi-Chip Module (MCM). The mounting structure intervenes between the IC and the MCM substrate, and promotes heat dissipation from the IC. The mounting structure is insulative, and preferably comprises a direct bond to copper (DBC) board. A heat spreading region to which the IC is affixed is formed on a surface of the mounting structure with bond pad areas are around the heat spreading region. The other side of the mounting structure is mounted to the substrate, which also has bond pads. Bond pads on the IC are connected to the bond pad areas on the mounting structure, and the bond pad areas on the mounting structure are further coupled to the bond pads on the substrate. Each of these connections is preferably made by wirebonding. Thermal vias can be used in the mounting structure and/or in the substrate to further promote heat dissipation.

Abstract: A system for dissipating heat from a semiconductor board includes a first substrate including an opening formed therein, a second substrate attached to a surface of the first substrate, and a microchip positioned in the opening and bumped to the second substrate. The system further includes a heat sink directly adhered to the microchip. A method of manufacturing a heat dissipating semiconductor board includes forming an opening in a first substrate and positioning a microchip in the opening. The method further includes directly adhering the microchip to a heat sink, bonding the microchip to a second substrate and boding a surface of the first substrate to the second substrate.

Abstract: Disclosed is a mounting structure for mounting an IC on a substrate, and particularly useful in a Multi-Chip Module (MCM). The mounting structure intervenes between the IC and the MCM substrate, and promotes heat dissipation from the IC. The mounting structure is insulative, and preferably comprises a direct bond to copper (DBC) board. A heat spreading region to which the IC is affixed is formed on a surface of the mounting structure with bond pad areas are around the heat spreading region. The other side of the mounting structure is mounted to the substrate, which also has bond pads. Bond pads on the IC are connected to the bond pad areas on the mounting structure, and the bond pad areas on the mounting structure are further coupled to the bond pads on the substrate. Each of these connections is preferably made by wirebonding. Thermal vias can be used in the mounting structure and/or in the substrate to further promote heat dissipation.

Abstract: A method and apparatus for calibrating a sensor output that includes a logic unit (11) for receiving uncalibrated sensor signals from a sensor (13) and for receiving data from a data base unit (12) regarding test points that relate to that particular sensor's (13) performance. Based upon these inputs, the logic unit (11) can provide a sensor reading calibrated to a preselected standard.