Abstract: There is disclosed in one example a heat dissipator for an electronic apparatus, including: a planar vapor chamber having a substantially rectangular form factor, wherein a second dimension d2 of the rectangular form factor is at least approximately twice a first dimension d1 of the rectangular form factor; a first fan and second fan; and a first heat pipe and second heat pipe discrete from the planar vapor chamber and disposed along first and second d1 edges of the planar vapor chamber, further disposed to conduct heat from the first and second d1 edges to the first and second fan respectively.

Abstract: An electronic device comprises a heat source and a heat distribution structure coupled to the heat source to distribute heat generated by the heat source during operation of the electronic device.

Abstract: Particular embodiments described herein provide for an electronic device that can be configured to include a hybrid thermal management system. The hybrid thermal management system can include a heat source, an air mover, a heat sink coupled to the air mover, a thermal electric cooling device (TEC), and a heat pipe. The heat pipe can couple the heat source to the heat sink and to the TEC and transfer heat from the heat source to the heat sink and to the TEC.

Abstract: In one aspect, an apparatus comprises a housing, a heat-generating component, a heat spreader, and a heat-transfer pipe. The housing forms a cavity in which the heat-generating component is located. The heat spreader is operable to distribute heat over a portion of the housing. The heat-transfer pipe is pivotally coupled to the heat-generating component and the heat spreader. The heat-transfer pipe operable to transfer heat from the heat-generating component to the heat spreader. The heat-transfer pipe and the heat spreader are movable between a first configuration and a second configuration. In the first configuration, a gap separates the heat spreader and the portion of the housing based on the heat-transfer pipe being at a first orientation. In the second configuration, the heat spreader closes the gap and is thermally coupled to the portion of the housing based on the heat-transfer pipe being at a second orientation.

Abstract: Methods, apparatus, systems and articles of manufacture are disclosed to configure multiple displays. An example apparatus disclosed herein includes memory, and a processor to execute instructions to detect, via a tag reader on a first display, a tag on a second display, the first display and second display communicatively coupled to a computing device, determine, based on a location of the tag reader relative to the first display, a position of the second display relative to the first display, and update an operating system of the computing device based on the determined position.

Abstract: There is disclosed in one example a heat dissipator for an electronic apparatus, including: a planar vapor chamber having a substantially rectangular form factor, wherein a second dimension d2 of the rectangular form factor is at least approximately twice a first dimension d1 of the rectangular form factor; a first fan and second fan; and a first heat pipe and second heat pipe discrete from the planar vapor chamber and disposed along first and second d1 edges of the planar vapor chamber, further disposed to conduct heat from the first and second d1 edges to the first and second fan respectively.

Abstract: Particular embodiments described herein provide for an electronic device that can be configured to include a hybrid thermal management system. The hybrid thermal management system can include a heat source, an air mover, a heat sink coupled to the air mover, a thermal electric cooling device (TEC), and a heat pipe. The heat pipe can couple the heat source to the heat sink and to the TEC and transfer heat from the heat source to the heat sink and to the TEC.

Abstract: In one aspect, an apparatus comprises a housing, a heat-generating component, a heat spreader, and a heat-transfer pipe. The housing forms a cavity in which the heat-generating component is located. The heat spreader is operable to distribute heat over a portion of the housing. The heat-transfer pipe is pivotally coupled to the heat-generating component and the heat spreader. The heat-transfer pipe operable to transfer heat from the heat-generating component to the heat spreader. The heat-transfer pipe and the heat spreader are movable between a first configuration and a second configuration. In the first configuration, a gap separates the heat spreader and the portion of the housing based on the heat-transfer pipe being at a first orientation. In the second configuration, the heat spreader closes the gap and is thermally coupled to the portion of the housing based on the heat-transfer pipe being at a second orientation.

Abstract: An apparatus and method for performing automatic keystone correction and automatic focus correction in a system. In one embodiment, the method comprises analyzing an image projected on a projection surface by a projector of a device and captured by one or more cameras of the device to determine whether shape of the image indicates keystone correction is needed and adjusting display output of the projector to cause the display output to be rectangular on the projection surface.