Patents by Inventor Gerry Keller

Gerry Keller has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Substrate free LED package
    Patent number: 10714533
    Abstract: A method of fabricating a substrate free light emitting diode (LED), includes arranging LED dies on a tape to form an LED wafer assembly, molding an encapsulation structure over at least one of the LED dies on a first side of the LED wafer assembly, removing the tape, forming a dielectric layer on a second side of the LED wafer assembly, forming an oversized contact region on the dielectric layer to form a virtual LED wafer assembly, and singulating the virtual LED wafer assembly into predetermined regions including at least one LED. The tape can be a carrier tape or a saw tape. Several LED dies can also be electrically coupled before the virtual LED wafer assembly is singulated into predetermined regions including at the electrically coupled LED dies.
    Type: Grant
    Filed: March 8, 2017
    Date of Patent: July 14, 2020
    Assignee: BRIDGELUX INC.
    Inventors: Mike Kwon, Gerry Keller, Scott West, Tao Tong, Babak Imangholi
  • SUBSTRATE FREE LED PACKAGE
    Publication number: 20170244008
    Abstract: A method of fabricating a substrate free light emitting diode (LED), includes arranging LED dies on a tape to form an LED wafer assembly, molding an encapsulation structure over at least one of the LED dies on a first side of the LED wafer assembly, removing the tape, forming a dielectric layer on a second side of the LED wafer assembly, forming an oversized contact region on the dielectric layer to form a virtual LED wafer assembly, and singulating the virtual LED wafer assembly into predetermined regions including at least one LED. The tape can be a carrier tape or a saw tape. Several LED dies can also be electrically coupled before the virtual LED wafer assembly is singulated into predetermined regions including at the electrically coupled LED dies.
    Type: Application
    Filed: March 8, 2017
    Publication date: August 24, 2017
    Inventors: Mike Kwon, Gerry Keller, Scott West, Tao Tong, Babak Imangholi
  • Substrate free LED package
    Patent number: 9627436
    Abstract: A method of fabricating a substrate free light emitting diode (LED), includes arranging LED dies on a tape to form an LED wafer assembly, molding an encapsulation structure over at least one of the LED dies on a first side of the LED wafer assembly, removing the tape, forming a dielectric layer on a second side of the LED wafer assembly, forming an oversized contact region on the dielectric layer to form a virtual LED wafer assembly, and singulating the virtual LED wafer assembly into predetermined regions including at least one LED. The tape can be a carrier tape or a saw tape. Several LED dies can also be electrically coupled before the virtual LED wafer assembly is singulated into predetermined regions including at the electrically coupled LED dies.
    Type: Grant
    Filed: March 14, 2014
    Date of Patent: April 18, 2017
    Assignee: BRIDGELUX, INC.
    Inventors: Mike Kwon, Gerry Keller, Scott West, Tao Tong, Babak Imangholi
  • SUBSTRATE FREE LED PACKAGE
    Publication number: 20140197430
    Abstract: A method of fabricating a substrate free light emitting diode (LED), includes arranging LED dies on a tape to form an LED wafer assembly, molding an encapsulation structure over at least one of the LED dies on a first side of the LED wafer assembly, removing the tape, forming a dielectric layer on a second side of the LED wafer assembly, forming an oversized contact region on the dielectric layer to form a virtual LED wafer assembly, and singulating the virtual LED wafer assembly into predetermined regions including at least one LED. The tape can be a carrier tape or a saw tape. Several LED dies can also be electrically coupled before the virtual LED wafer assembly is singulated into predetermined regions including at the electrically coupled LED dies.
    Type: Application
    Filed: March 14, 2014
    Publication date: July 17, 2014
    Applicant: BRIDGELUX, INC.
    Inventors: Mike Kwon, Gerry Keller, Scott West, Tao Tong, Babak Imangholi
  • Substrate free LED package
    Patent number: 8748202
    Abstract: A method of fabricating a substrate free light emitting diode (LED), includes arranging LED dies on a tape to form an LED wafer assembly, molding an encapsulation structure over at least one of the LED dies on a first side of the LED wafer assembly, removing the tape, forming a dielectric layer on a second side of the LED wafer assembly, forming an oversized contact region on the dielectric layer to form a virtual LED wafer assembly, and singulating the virtual LED wafer assembly into predetermined regions including at least one LED. The tape can be a carrier tape or a saw tape. Several LED dies can also be electrically coupled before the virtual LED wafer assembly is singulated into predetermined regions including at the electrically coupled LED dies.
    Type: Grant
    Filed: September 14, 2012
    Date of Patent: June 10, 2014
    Assignee: Bridgelux, Inc.
    Inventors: Mike Kwon, Gerry Keller, Scott West, Tao Tong, Babak Imangholi
  • Substrate Free LED Package
    Publication number: 20140077235
    Abstract: A method of fabricating a substrate free light emitting diode (LED), includes arranging LED dies on a tape to form an LED wafer assembly, molding an encapsulation structure over at least one of the LED dies on a first side of the LED wafer assembly, removing the tape, forming a dielectric layer on a second side of the LED wafer assembly, forming an oversized contact region on the dielectric layer to form a virtual LED wafer assembly, and singulating the virtual LED wafer assembly into predetermined regions including at least one LED. The tape can be a carrier tape or a saw tape. Several LED dies can also be electrically coupled before the virtual LED wafer assembly is singulated into predetermined regions including at the electrically coupled LED dies.
    Type: Application
    Filed: September 14, 2012
    Publication date: March 20, 2014
    Applicant: BRIDGELUX, INC.
    Inventors: Mike Kwon, Gerry Keller, Scott West, Tao Tong, Babak Imangholi