Patents by Inventor Gerry Moore

Gerry Moore has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 7824146
    Abstract: Automated systems and methods for adapting semiconductor fabrication tools to process wafers of different diameters are described. In one embodiment, a method comprises providing a semiconductor fabrication tool, placing an adapter ring on a plurality of ring holders via a robotic arm, the plurality of ring holders being operable to support the adapter ring at a vertical distance from a stage heater and the stage heater being movable in a vertical direction, placing a first semiconductor wafer on the stage heater via the robotic arm, the first semiconductor wafer having a first diameter, and moving the stage heater upward to receive the adapter ring from the plurality of ring holders and to cover a portion of the stage heater during processing of the first semiconductor wafer.
    Type: Grant
    Filed: September 7, 2007
    Date of Patent: November 2, 2010
    Assignee: Advanced Technology Development Facility
    Inventors: Khamsidi Lanee, Gerry Moore
  • Publication number: 20090067954
    Abstract: Automated systems and methods for adapting semiconductor fabrication tools to process wafers of different diameters are described. In one embodiment, a method comprises providing a semiconductor fabrication tool, placing an adapter ring on a plurality of ring holders via a robotic arm, the plurality of ring holders being operable to support the adapter ring at a vertical distance from a stage heater and the stage heater being movable in a vertical direction, placing a first semiconductor wafer on the stage heater via the robotic arm, the first semiconductor wafer having a first diameter, and moving the stage heater upward to receive the adapter ring from the plurality of ring holders and to cover a portion of the stage heater during processing of the first semiconductor wafer.
    Type: Application
    Filed: September 7, 2007
    Publication date: March 12, 2009
    Inventors: Khamsidi Lanee, Gerry Moore
  • Patent number: 6500271
    Abstract: A pipeline pig for removing scales and debris from the interior walls of a pipeline has a generally cylindrical central portion with a hollow core and a rounded end on each two ends of the cylindrical central portion, is produced of a flexible material to facilitate the movement of the pipeline pig through non-linear sections of a pipeline and buildups of scale and debris in a pipeline, has a solution which fills the hollow core, and includes a body which is formed as a peripheral fluid closed body composed of the flexible material.
    Type: Grant
    Filed: August 2, 2000
    Date of Patent: December 31, 2002
    Inventors: Darren Moore, Gerry Moore, Jamie Magnusson, Chris Boase