Patents by Inventor Gert Pfahl

Gert Pfahl has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Semiconductor substrate having a bond pad material based on aluminum
    Patent number: 11410950
    Abstract: A semiconductor substrate has a bond pad. The bond pad includes a layer of an aluminum alloy having a chemical composition including at least 0.3% by weight of at least one of Zn, Mg, Sc, Zr, Ti, Ag and/or Mn, with the balance being at least Al and incidental impurities.
    Type: Grant
    Filed: September 17, 2020
    Date of Patent: August 9, 2022
    Assignee: Infineon Technologies AG
    Inventors: Gert Pfahl, Daniel Bolowski, Marian Sebastian Broll, Michael Kreuz, Evelyn Napetschnig, Holger Schulze, Stefan Woehlert
  • Semiconductor Substrate Having a Bond Pad Material Based on Aluminum
    Publication number: 20210091025
    Abstract: A semiconductor substrate has a bond pad. The bond pad includes a layer of an aluminum alloy having a chemical composition including at least 0.3% by weight of at least one of Zn, Mg, Sc, Zr, Ti, Ag and/or Mn, with the balance being at least Al and incidental impurities.
    Type: Application
    Filed: September 17, 2020
    Publication date: March 25, 2021
    Inventors: Gert Pfahl, Daniel Bolowski, Marian Sebastian Broll, Michael Kreuz, Evelyn Napetschnig, Holger Schulze, Stefan Woehlert