Patents by Inventor Gert Pohl

Gert Pohl has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20090301891
    Abstract: The invention relates to a device for the electrolytic coating of a structured or full-surface base layer (9) on a surface of a substrate (7), which comprises at least one electrolyte bath (3) having at least one rotatably mounted roller (2) connectable as a cathode, which contacts the base layer (9) during the electrolytic coating, the base layer (9) being covered by an electrolyte solution (5) contained in the electrolyte bath (3) and being moved relative to the at least one roller (2) during the coating. The at least one roller (2) connectable as a cathode is connected cathodically during the contact with the base layer (9) and is connected neutrally or anodically as soon as there is no contact with the base layer (9).
    Type: Application
    Filed: November 26, 2007
    Publication date: December 10, 2009
    Applicant: BASF SE
    Inventors: Rene Locktman, Jürgen Kaczun, Norbert Wagner, Jürgen Pfister, Gert Pohl
  • Publication number: 20090178930
    Abstract: The invention relates to a device for the electrolytic coating of at least one electrically conductive substrate or a structured or full-surface electrically conductive surface on a nonconductive substrate, which comprises at least one bath, one anode and one cathode, the bath containing an electrolyte solution containing at least one metal salt, from which metal ions are deposited on electrically conductive surfaces of the substrate to form a metal layer while the cathode is brought in contact with the substrate's surface to be coated and the substrate is transported through the bath, wherein the cathode comprises at least two disks (2, 4, 10) mounted on a respective shaft (1, 5, 14) so that they can rotate, the disks (2, 4, 10) engaging in one another. The invention furthermore relates to a method for the electrolytic coating of at least one substrate, which is carried out in a device according to the invention.
    Type: Application
    Filed: April 5, 2007
    Publication date: July 16, 2009
    Applicant: BASF SE
    Inventors: Rene Lochtman, Jürgen Kaczun, Norbert Schneider, Jürgen Pfister, Gert Pohl, Norbert Wagner
  • Publication number: 20090101511
    Abstract: The invention relates to a device for the electrolytic coating of at least one electrically conductive substrate (8) or a structured or full-surface electrically conductive surface on a nonconductive substrate (8), which comprises at least one bath, one anode and one cathode (1), the bath containing an electrolyte solution containing at least one metal salt, from which metal ions are deposited on electrically conductive surfaces of the substrate to form a metal layer while the cathode is brought in contact with the surface to be coated of the substrate and the substrate is transported through the bath. The cathode comprises at least one band (2) having at least one electrically conductive section (12), which is guided around at least two rotatable shafts (3).
    Type: Application
    Filed: April 17, 2007
    Publication date: April 23, 2009
    Inventors: Rene Lochtman, Juergen Kaczun, Norbert Schneider, Juergen Pfister, Gert Pohl, Norbert Wagner
  • Patent number: 5071508
    Abstract: The invention concerns a method of etching an etch material consisting at least partly of metal and an arrangement for implementing that method.According to the invention, the etchant is applied through jet assemblies arranged perpendicularly to each other on the top and the bottom side of the etch material. During the passage of the etch material, the spray pressure at the jet assemblies or the jets may be set to constant values and/or be individually controlled as a function of the quantity of metal to be etched off the top and the bottom side. The invention is particularly suitable for etching circuit boards, whose conductors on the top and the bottom side are arranged perpendicularly to each other.
    Type: Grant
    Filed: October 3, 1990
    Date of Patent: December 10, 1991
    Assignee: International Business Machines Corporation
    Inventors: Alfred Scheithauer, Wolfgang Alberth, Gert Pohl, Herbert Ziegler
  • Patent number: 5002627
    Abstract: The invention concerns a method of etching an etch material consisting at least partly of metal and an arrangement for implementing that method. According to the invention, the etchant is applied through jet assemblies arranged perpendicularly to each other on the top and the bottom side of the etch material. During the passage of the etch material, the spray pressure at the jet assemblies or the jets may be set to constant values and/or by individually controlled as a function of the quantity of metal to be etched off the top and the bottom side. The invention is particularly suitable for etching circuit boards, whose conductors on the top and the bottom side are arranged perpendicularly to each other.
    Type: Grant
    Filed: August 7, 1989
    Date of Patent: March 26, 1991
    Assignee: International Business Machines Corporation
    Inventors: Alfred Scheithauer, Wolfgang Alberth, Gert Pohl, Herbert Ziegler