Patents by Inventor Gert van Tiel

Gert van Tiel has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Electrical component comprising a hotmelt element, method and tool for manufacturing such an electrical component
    Patent number: 8106298
    Abstract: An electrical component having at least one cable element, at least one solder joint, at least one hotmelt element and at least one substrate element, a method of manufacturing such an electrical component, and a tool for manufacturing the electrical component. The cable element is connected with the substrate element by the solder joint. The at least one solder joint is not embedded in the hotmelt element. Preferably, the solder joint is free from the hotmelt material of the hotmelt element. Wherein a flow of hotmelt material is stopped before it reaches the solder joint. A hotmelt cavity for forming the hotmelt element from hotmelt material is separated from a substrate cavity adapted to receive the substrate element by a compressible solder sealing.
    Type: Grant
    Filed: December 30, 2010
    Date of Patent: January 31, 2012
    Assignee: Tyco Electronics Nederland BV
    Inventors: Gert van Tiel, Jan Van Tilburg
  • Electrical component comprising a hotmelt element
    Patent number: 8106296
    Abstract: An electrical component having at least one cable element, at least one solder joint, at least one hotmelt element and at least one substrate element. The cable element is connected with the substrate element by the solder joint. The at least one solder joint is not embedded in the hotmelt element. Preferably, the solder joint is free from the hotmelt material of the hotmelt element.
    Type: Grant
    Filed: December 30, 2010
    Date of Patent: January 31, 2012
    Assignee: Tyco Electronics Nederland BV
    Inventors: Gert van Tiel, Jan Van Tilburg
  • Electrical component comprising a hotmelt element
    Publication number: 20110162882
    Abstract: The invention relates to an electrical component comprising at least one cable element, at least one solder joint, at least one hotmelt element and at least one substrate element. The cable element is connected with the substrate element by the solder joint. To improve the data transmission rate, the at least one solder joint is not embedded in the hotmelt element. Preferably, the solder joint is not covered the hotmelt material of the hotmelt element.
    Type: Application
    Filed: December 30, 2010
    Publication date: July 7, 2011
    Applicant: Tyco Electronics Nederland BV
    Inventors: Gert van Tiel, Jan Van Tilburg
  • Electrical component comprising a hotmelt element, method and tool for manufacturing such an electrical component
    Publication number: 20110162886
    Abstract: The invention relates to an electrical component having at least one cable element, at least one solder joint, at least one hotmelt element and at least one substrate element. The cable element is connected with the substrate element by the solder joint. To improve the data transmission rate, the at least one solder joint is not embedded in the hotmelt element. Preferably, the solder joint is free from the hotmelt material of the hotmelt element. The invention is also concerned with a method of manufacturing such an electrical component. According to the inventive method, a flow of hotmelt material is stopped before it reaches the solder joint. Finally, the invention is concerned with providing a tool for manufacturing the electrical component. Here, a hotmelt cavity for forming the hotmelt element from hotmelt material is separated from a substrate cavity adapted to receive the substrate element by a compressible solder sealing.
    Type: Application
    Filed: December 30, 2010
    Publication date: July 7, 2011
    Applicant: Tyco Electronics Nederland BV
    Inventors: Gert van Tiel, Jan Van Tilburg