Abstract: A method for fabricating an electronic device includes forming a layer of precursor material for forming a semi-conductor material in a cured state and exposing the precursor material to light. The precursor is heated in the presence of the light to form an insulator in areas exposed to light and a semiconductor in areas not exposed to the light. The light is preferably in the visible range. Suitable precursors may include 6,13-dihydro-6,13-(2,3,4,5-tetrachloro-2,4-cyclohexadieno)-pentacene (202) to form, for example, pentacene (204) as the semiconductor and 6,13-pentacenequinone (206) as an insulator. A device made in accordance with the method is also included.

Abstract: A method for fabricating an electronic device includes forming a layer of precursor material for forming a semi-conductor material in a cured state and exposing the precursor material to light. The precursor is heated in the presence of the light to form an insulator in areas exposed to light and a semiconductor in areas not exposed to the light. The light is preferably in the visible range. Suitable precursors may include 6,13-dihydro-6,13-(2,3,4,5-tetrachloro-2,4-cyclohexadieno)-pentacene (202) to form, for example, pentacene (204) as the semiconductor and 6,13-pentacenequinone (206) as an insulator. A device made in accordance with the method is also included.

Abstract: Semiconducting device and method of manufacturing a semiconducting device in which organic thin film transistors (TFTs) and other components are fabricated on a substrate (206), using a hybrid technology of lithographic and printing steps. A lithographically defined resist pattern (211, 311) provides barriers and cavities which serve to guide subsequently printed materials. Different components of the integrated circuitry form separate islands on the substrate (206). The risk of adjacent films cracking and peeling from stress is reduced. The flexibility of the device is increased.