Abstract: Disclosed is a heat radiation substrate, which includes a hybrid layer made of a thermoplastic resin, in particular, a liquid crystal polymer, and thus is lightweight and small thanks to the inherent properties of plastic and also is able to be mass produced, thus reducing the material and process costs.

Abstract: A backlight unit is disclosed. The backlight unit may include a thermoplastic resin board in which cavities may be formed, a light emitting diode (LED) component which may be mounted on a bottom surface of the cavity, and a molding resin which may be filled in the cavity and which may secure the light emitting diode component. The thermoplastic resin board may include a light-reflective filler, to improve reflection efficiency, dispersed within the thermoplastic resin board. According to certain embodiments of the invention, a simple process can be utilized to reduce the thickness of the backlight unit, making it applicable to compact devices.

Abstract: Disclosed are a light emitting diode package and a manufacturing method thereof. According to an embodiment of the present invention, the method includes: manufacturing a package main body having a plurality of cavities, the cavities being formed in a line on one surface, through molding by putting thermoplastic polymer into a previously produced mold; forming an electrode passing through the package main body; mounting a light emitting diode chip on a basal surface of the each cavity formed in the package main body; connecting electrically the light emitting diode chip and the electrode by using a bonding means; and sealing the light emitting diode chip and the bonding means by using a molding resin.

Abstract: Disclosed are an array light source using a light-emitting diode and a backlight unit including the same. In accordance with an embodiment of the present invention, the array light source can include a plurality of light-emitting diodes (LED); and a wiring board on which wires for transferring signals to each of the LEDs are formed. Here, the wiring board can include a plurality of sublayers, and the wires can be divided into at least two wiring groups and separately formed on different sublayers of the wring board per wiring group.

Abstract: The present invention relates a eucryptite ceramic filler and an insulating composite material containing the eucryptite ceramic filler. In particular, the invention provides a eucryptite ceramic filler of formula (I): xLiO2-yAl2O3-zSiO2 ??(I) wherein x, y and z represent a molar ratio, x and y are each independently from 0.9 to 1.1, and z is from 1.9 to 2.1; and the eucryptite ceramic filler is used to reduce a coefficient of thermal expansion of an insulating composite material.

Abstract: Disclosed are a multi-layer printed circuit board and a method for manufacturing the multi-layer printed circuit board. Circuit layers and insulating layers are alternately stacked so that via holes of the circuit layers provided with plated inner walls without application of additional plating and conductive paste-filling steps are connected to via holes of the insulating layers filled with a conductive paste.

Abstract: Disclosed are a multi-layer printed circuit board and a method for manufacturing the multi-layer printed circuit board. Circuit layers and insulating layers are alternately stacked so that via holes of the circuit layers provided with plated inner walls without application of additional plating and conductive paste-filling steps are connected to via holes of the insulating layers filled with a conductive paste.