Abstract: A method for sawing a wafer having a large number of semiconductor devices, e.g., image sensor devices is provided. In one embodiment, a protective layer covers micro-lenses of the image sensor devices to protect the lenses from being damaged or polluted by, for example, silicon dust during wafer sawing. The silicon dust remaining in a gap between the devices is removed together with an adhesive tape on the backside surface of the wafer. Accordingly, the silicon dust cannot affect the micro-lenses during the wafer sawing process or subsequent die-attach, so that image defects caused by the silicon dust can be reduced and the yield of the image sensor devices is increased.

Abstract: A method for sawing a wafer having a large number of semiconductor devices, e.g., image sensor devices is provided. In one embodiment, a protective layer covers micro-lenses of the image sensor devices to protect the lenses from being damaged or polluted by, for example, silicon dust during wafer sawing. The silicon dust remaining in a gap between the devices is removed together with an adhesive tape on the backside surface of the wafer. Accordingly, the silicon dust cannot affect the micro-lenses during the wafer sawing process or subsequent die-attach, so that image defects caused by the silicon dust can be reduced and the yield of the image sensor devices is increased.