Abstract: A drum washing machine having an improved air circulation structure thereof. The drum washing machine includes a cabinet, a tub arranged within the cabinet, a drum rotatably arranged within the tub, a drying unit which heats and circulates air discharged from the tub so as to dry laundry within the drum, the drying unit including a drying duct equipped with a heater to heat air therein, a circulation passage provided such that air circulates between the tub and the inside of the drying duct, and a suction member which is coupled to one side of the drying duct and introduces air outside the tub onto the circulation passage, and a discharge member which is coupled to one side of the tub and discharges part of the air in the circulation passage to the outside of the cabinet.

Abstract: In one embodiment, a semiconductor package includes a semiconductor die having conductive pads. A lead frame is directly connected to the conductive pads using an electrochemically formed layer or a conductive adhesive layer thereby facilitating an electrical connection between the conductive pads of the semiconductor die and the lead frame without using separate wire bonds or conductive bumps.

Abstract: Disclosed are a semiconductor device and a manufacturing method thereof, which can easily increase the number of input/output pads by increasing regions for forming the input/output pads such that a redistribution layer is formed to extend up to an encapsulant.

Abstract: A dryer is provided, which includes a communicator configured to perform communication with a server that is connected to a network, and a processor configured to receive washing information that is pre-stored in the server from the server and to set a drying course for drying laundry that is put into the dryer based on the washing information.

Abstract: A light emitting device may be provided that includes a substrate, a light emitting structure, a first electrode on a part of the first semiconductor layer, an electrode layer on the second conductive semiconductor layer, an insulating layer on the electrode layer, a second electrode on the electrode layer, a support member on the insulating layer, a first connection electrode connected to the first electrode, and a second connection electrode connected to the second electrode. The insulating layer is disposed on a side surface of the light emitting structure and the part of the first semiconductor layer. The insulating layer includes a first layer and a second layer having a different material from the first layer. The first layer of the insulating layer has a refractive index different from the second layer of the insulating layer.

Abstract: Disclosed is a method for displaying a panoramic image by an electronic device. According to an example embodiment of the present disclosure, a method for generating a panoramic image may comprise sensing a direction that a first side surface of the electronic device faces through a sensor included in the electronic device, displaying a first partial image of the panoramic image corresponding to the sensed direction of the first side surface, determining a direction corresponding to the reference view information with respect to the first partial image if information regarding the first partial image differs from reference view information indicating a reference view for the panoramic image, and providing information about the determined direction.

Abstract: Disclosed are a light emitting device, a light emitting device package and a light emitting module. The light emitting device includes a light emitting structure including a first conductive semiconductor layer, a second conductive semiconductor layer and an active layer between the first and second conductive semiconductor layers; a support member under the light emitting structure; a reflective electrode layer between the second conductive semiconductor layer and the support member; and first to third connection electrodes spaced apart from each other in the support member. The second connection electrode is disposed between the first and third connection electrodes, the first and third connection electrodes are electrically connected with each other, and the support member is disposed at a peripheral portion of the first to third connection electrodes.

Abstract: A semiconductor device and a method of manufacturing a semiconductor device. As a non-limiting example, various aspects of this disclosure provide a semiconductor device, and method of manufacturing thereof, that comprises a redistribution structure formed on a stiffening layer.

Abstract: A light-emitting diode having a multilayer bonding pad includes: a P1 layer disposed under a light-emitting structure and configured to improve ohmic contact and adhesion; a P3 layer disposed under the P1 layer and configured to prevent diffusion; a Sn-based metal layer disposed under the P1 layer and configured to enhance soldering weldability and prevent oxidation; a Cu-based P5 layer disposed on the Sn-based metal layer and configured to prevent the diffusion of Sn; and a P4 layer disposed between the P3 layer and the P5 layer and configured to suppress the reaction between the P5 layer and other layers.

Abstract: Disclosed herein is a washing machine including a main body having a washing space and an opening through which clothes are inserted and withdrawn into and from the washing space, a door to open and close the opening, and a sub-washing unit to form a sub-washing space separate from the washing space and separably provided from the door. By such configuration, sub-washing may be efficiently performed, and space utilization may be improved.

Abstract: A method for detecting a degree of blockage of an exhaust duct includes detecting the temperature of air in an intake and exhaust system, calculating a rate of change of the detected temperature, and determining a degree of blockage of the exhaust duct based on the detected temperature and the rate of change of the detected temperature.

Abstract: Disclosed herein is a dryer which includes a drum for accommodating an object to be dried, a combustion device for combusting gas to heat air, a blowing device for transferring the heated air into the drum, and a valve assembly for controlling a gas discharge amount supplied to the combustion device, wherein the valve assembly may operate in one mode among a high heating power mode which maximizes the gas discharge amount, a low heating power mode which generates 50% or less heating power compared to the high heating power mode, and a standby mode which blocks the gas discharge.

Abstract: A light emitting device is provided a transmissive substrate; a first pattern portion including a protrusions; a second pattern portion including a concaves having a width smaller than a width of each protrusion; a light emitting structure under the transmissive substrate and including a first conductive semiconductor layer, a second conductive semiconductor layer and an active layer; a first electrode under the first conductive semiconductor layer; a reflective electrode layer under the second conductive semiconductor layer; a second electrode under the reflective electrode layer; a first connection electrode under the first electrode; a second connection electrode under the second electrode; and an insulating support member around the first electrode and the first connection electrode and around the second electrode and the second connection electrode and including a ceramic-based thermal diffusion agent.

Abstract: A method and system for erasing data stored in a storage medium of a computer system is disclosed. According to one embodiment, a booting parameter of an operating system of the computer system is changed to a data erasure program. After the computer system is rebooted, the data erasure program is launched, and a disk drive of the computer system is erased by overwriting with a pattern of data. The data erasure program runs in a native mode of the operating system prior to executing a file system check routine of the operating system.

Abstract: A method for manufacturing a semiconductor device and a semiconductor device produced thereby. For example and without limitation, various aspects of this disclosure provide methods for manufacturing a semiconductor device, and semiconductor devices produced thereby, that comprise forming an interposer including a reinforcement layer.

Abstract: In one embodiment, a semiconductor package includes a semiconductor die having conductive pads. A lead frame is directly connected to the conductive pads using an electrochemically formed layer or a conductive adhesive layer thereby facilitating an electrical connection between the conductive pads of the semiconductor die and the lead frame without using separate wire bonds or conductive bumps.

Abstract: A light emitting device may be provided that includes a substrate, a light emitting structure, a first electrode under the first semiconductor layer, a reflective electrode layer under the second conductive semiconductor layer, a second electrode under the reflective electrode layer, and a support member under the first semiconductor layer and the reflective electrode layer around the first and second electrodes. A first connection electrode may be provided under the first electrode. At least a part of the first connection electrode is provided in the support member. A second connection electrode may be provided under the second electrode At least a part of the second connection electrode may be provided in the support member.

Abstract: A light emitting device may be provided that includes a substrate, a light emitting structure, a first electrode on a part of the first semiconductor layer, an electrode layer on the second conductive semiconductor layer, an insulating layer on the electrode layer, a second electrode on the electrode layer, a support member on the insulating layer, a first connection electrode connected to the first electrode, and a second connection electrode connected to the second electrode. The insulating layer is disposed on a side surface of the light emitting structure and the part of the first semiconductor layer. The insulating layer includes a first layer and a second layer having a different material from the first layer. The first layer of the insulating layer has a refractive index different from the second layer of the insulating layer.

Abstract: An apparatus and method for providing a Hearing Aid Compatibility (HAC) mode in an electronic device are provided, including detecting a type of battery, and applying an audio adjusting parameter for the HAC mode according to the detected type of battery.

Abstract: A method and system for synchronizing an encrypted file with a remote storage is disclosed. According to one embodiment, a computer-implemented method comprises providing a user with a user application and an encryption key in a portable memory device. The user runs the user application to securely access to a storage on a cloud storage system. A file is encrypted with the encryption key stored in the portable memory device and synchronized with the cloud storage system.