Abstract: A semiconductor device may include a first film and a second film defining parts of a trench, a plug conductive film, a via, and a wiring in the trench. The trench may include a second sub-trench having a second width below a first sub-trench having a first width. The plug conductive film may extend from a first side of the first film to penetrate a bottom face of the trench. An uppermost face of the plug conducive film may be in the trench. The via may include an insulating liner between the plug conductive film and the first film. The uppermost face of the plug conductive film and at least a part of a side wall of the plug conductive film may be in contact with the wiring. An upper face of the insulating liner may be exposed by a bottom face of the second sub-trench.

Abstract: The present invention introduces a plasma etching method and apparatus. The plasma etching method may include forming a photoresist pattern on a target etching layer, hardening the surface of the photoresist pattern by exposing to a first plasma generated from a first discharge gas containing a reforming gas including carbon (C) and sulfur (S) and sequentially annealing, and etching the target etching layer with a second plasma generated from a second discharge gas using the surface-hardened photoresist pattern as a mask.

Abstract: A semiconductor package structure include a silicon substrate, a plurality of dies on the silicon substrate, a mold layer between the plurality of dies, a metal layer covering an upper side of the mold layer and at least a part of upper sides of each of the plurality of dies, and including an opening that exposes a part of the upper side of at least one die among the plurality of dies, and a temperature controller configured to control a temperature of the plurality of dies, the temperature controller including a body defining a circulation region configured to circulate a fluid for controlling the temperature of the plurality of dies, and a passage part configured to allow the fluid to flow into or out of the circulation region, and the fluid in the circulation region being in direct contact with exposed upper sides of the plurality of dies.

Abstract: A laser bonding system which improves bonding between a semiconductor chip and a substrate is provided. A laser bonding system comprises a laser bonding apparatus; and a controller configured to control the laser bonding apparatus, wherein the laser bonding apparatus includes a stage which supports a substrate including a pad, and a semiconductor chip including a connection terminal; a pressurizer which moves up and down above the stage; a temperature measuring sensor configured to measure a temperature of the semiconductor chip and generate a temperature value; and a laser radiation apparatus configured to bond a pad of the substrate and a connection terminal of the semiconductor chip, using a laser beam passing through the pressurizer, and the controller lifts the pressurizer in response to the temperature value.

Abstract: An information processing system includes a first electronic device configured to collect data, a second electronic device configured to obtain at least a portion of the data from the first electronic device and process the at least the portion of the data, and a server configured to support a sharing service that obtains the processed data from the second electronic device and posts the processed data in a designated method. The second electronic device is configured to transmit account information on at least one account joined to the sharing service to the first electronic device. The first electronic device is configured to analyze the account information to verify the at least one account, generate an object supporting posting the processed data on the sharing service, and output the object to a display of the first electronic device.

Abstract: An electronic device includes a display, a memory configured to store priorities of sensors included in at least one of the electronic device and an external electronic device connected to the electronic device through a communication circuit, the priorities being set based on a type of exercise, a processor electrically connected to the display and the memory, and a connection interface configured to electrically connect the processor with the sensors. The processor is configured to select at least one first sensor of the sensors, based on the stored priorities of the sensors when the type of the exercise is designated, to designate the first sensor as an exercise measuring sensor that measures the exercise, to obtain first sensing data, based on the exercise, through the exercise measuring sensor, to analyze the first sensing data, and to provide exercise information based on the analyzed result of the first sensing data.

Abstract: A method and apparatus for providing workout guide information are provided. The apparatus includes a display, a memory configured to store workout route data including location data and elevation data, and a user profile, and a processor configured to determine at least one slope section through an analysis of the workout route data based on the user profile and output a map for displaying a workout route including the slope section to the display. The slope section in the workout route is configured to be displayed in a different form than a non-slope section. In addition, various embodiments identified throughout the specification are disclosed.

Abstract: An image processing method and an electronic device supporting the same are disclosed. An electronic device is provided to collect a plurality of images. The electronic device may collect the images by taking pictures/videos with a camera or by receiving the images from an external device. The electronic device also includes a processor able to determine an activity type during at least a portion of time when the images were taken by the camera or an activity type of the device that originally generated the images received from the external device. The processor may be able to select at least some of the collected images based on the activity type to generate a highlight content.

Abstract: An information processing system includes a first electronic device configured to collect data, a second electronic device configured to obtain at least a portion of the data from the first electronic device and process the at least the portion of the data, and a server configured to support a sharing service that obtains the processed data from the second electronic device and posts the processed data in a designated method. The second electronic device is configured to transmit account information on at least one account joined to the sharing service to the first electronic device. The first electronic device is configured to analyze the account information to verify the at least one account, generate an object supporting posting the processed data on the sharing service, and output the object to a display of the first electronic device.

Abstract: An electronic device includes a display, a memory configured to store priorities of sensors included in at least one of the electronic device and an external electronic device connected to the electronic device through a communication circuit, the priorities being set based on a type of exercise, a processor electrically connected to the display and the memory, and a connection interface configured to electrically connect the processor with the sensors. The processor is configured to select at least one first sensor of the sensors, based on the stored priorities of the sensors when the type of the exercise is designated, to designate the first sensor as an exercise measuring sensor that measures the exercise, to obtain first sensing data, based on the exercise, through the exercise measuring sensor, to analyze the first sensing data, and to provide exercise information based on the analyzed result of the first sensing data.

Abstract: A method for operating semiconductor manufacturing equipment is provided. The method includes forming a conductive thin film on an inner side surface of a reaction chamber and on a substrate in the reaction chamber, the conductive thin film including a first conductive material, and forming a particle preventive layer on the inner side surface of the reaction chamber in which the conductive thin film is formed.

Abstract: A method and apparatus for providing workout guide information are provided. The apparatus includes a display, a memory configured to store workout route data including location data and elevation data, and a user profile, and a processor configured to determine at least one slope section through an analysis of the workout route data based on the user profile and output a map for displaying a workout route including the slope section to the display. The slope section in the workout route is configured to be displayed in a different form than a non-slope section. In addition, various embodiments identified throughout the specification are disclosed.

Abstract: An image processing method and an electronic device supporting the same are disclosed. An electronic device is provided to collect a plurality of images. The electronic device may collect the images by taking pictures/videos with a camera or by receiving the images from an external device. The electronic device also includes a processor able to determine an activity type during at least a portion of time when the images were taken by the camera or an activity type of the device that originally generated the images received from the external device. The processor may be able to select at least some of the collected images based on the activity type to generate a highlight content.

Abstract: A method for operating semiconductor manufacturing equipment is provided. The method includes forming a conductive thin film on an inner side surface of a reaction chamber and on a substrate in the reaction chamber, the conductive thin film including a first conductive material, and forming a particle preventive layer on the inner side surface of the reaction chamber in which the conductive thin film is formed.

Abstract: A device and a method for providing user activity information in a portable terminal are provided. The method includes receiving and storing log data from a specific application, generating user situation information representing a current status of a user based on the stored log data, and transmitting the generated user situation information to the specific application.

Abstract: A semiconductor device defect detecting apparatus including: a sensor disposed on semiconductor process equipment, the sensor configured to detect a signal emitted from a semiconductor device in contact with the semiconductor process equipment; and a signal analyzer configured to determine whether the semiconductor device is defective based on the detected signal in a predetermined frequency range.

Abstract: A mobile device having at least two antennas can circumvent transmission problems caused by a user's grasp of the device. A sensor unit is disposed at a specific location of a device body and creates a sensor signal by detecting the contact or proximity of a particular object such a user's hand. When receiving the sensor signal, a control unit selects one of the antennas depending on the sensor signal and establishes a communication path based on the selected antenna. The selected antenna involved in the communication path is typically relatively free from degradation in transmission caused by a user's grasp of the mobile device. The radiation property of the mobile device, which may be degraded due to a user's grasp, can exhibit relatively little or no degradation as compared to the typical degradation in performance when the mobile device is being grasped.

Abstract: Provided is a lead frame that may include a frame, a lead structure, and a dam bar. The frame may include a plurality of openings configured to receive semiconductor chips. The lead structure may be in the openings. The lead structure may also include inner leads and outer leads. The inner leads may be configured to electrically connect to the semiconductor chips and the outer leads may extend from the inner leads. In example embodiments, the lead structure may extend in a first direction. The dam bar may be arranged between the inner leads and the outer leads. In accordance with example embodiments, the dam bar may extend along a second direction which is substantially perpendicular to the first direction. In example embodiments, the dam bar may have a first strength-reinforcing portion extending along the second direction. Also provided is a semiconductor package having the lead frame.

Abstract: A mobile device having at least two antennas can circumvent transmission problems caused by a user's grasp of the device. A sensor unit is disposed at a specific location of a device body and creates a sensor signal by detecting the contact or proximity of a particular object such a user's hand. When receiving the sensor signal, a control unit selects one of the antennas depending on the sensor signal and establishes a communication path based on the selected antenna. The selected antenna involved in the communication path is typically relatively free from degradation in transmission caused by a user's grasp of the mobile device. The radiation property of the mobile device, which may be degraded due to a user's grasp, can exhibit relatively little or no degradation as compared to the typical degradation in performance when the mobile device is being grasped.

Abstract: Provided is a lead frame that may include a frame, a lead structure, and a dam bar. The frame may include a plurality of openings configured to receive semiconductor chips. The lead structure may be in the openings. The lead structure may also include inner leads and outer leads. The inner leads may be configured to electrically connect to the semiconductor chips and the outer leads may extend from the inner leads. In example embodiments, the lead structure may extend in a first direction. The dam bar may be arranged between the inner leads and the outer leads. In accordance with example embodiments, the dam bar may extend along a second direction which is substantially perpendicular to the first direction. In example embodiments, the dam bar may have a first strength-reinforcing portion extending along the second direction. Also provided is a semiconductor package having the lead frame.