Patents by Inventor Geunbae Lim

Geunbae Lim has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 7402736
    Abstract: A probe of a scanning probe microscope having a sharp tip and an increased electric characteristic by fabricating a planar type of field effect transistor and manufacturing a conductive carbon nanotube on the planar type field effect transistor. To achieve this, the present invention provides a method for fabricating a probe having a field effect transistor channel structure including fabricating a field effect transistor, making preparations for growing a carbon nanotube at a top portion of a gate electrode of the field effect transistor, and generating the carbon nanotube at the top portion of the gate electrode of the field effect transistor.
    Type: Grant
    Filed: December 23, 2005
    Date of Patent: July 22, 2008
    Assignee: POSTECH Foundation
    Inventors: Wonkyu Moon, Geunbae Lim, Sang Hoon Lee
  • Publication number: 20060230475
    Abstract: Disclosed is a probe of a scanning probe microscope having a sharp tip and an increased electric characteristic by fabricating a planar type of field effect transistor and manufacturing a conductive carbon nanotube on the planar type field effect transistor. To achieve this, the present invention provides a method for fabricating a probe having a field effect transistor channel structure including fabricating a field effect transistor, making preparations for growing a carbon nanotube at a top portion of a gate electrode of the field effect transistor, and generating the carbon nanotube at the top portion of the gate electrode of the field effect transistor.
    Type: Application
    Filed: December 23, 2005
    Publication date: October 12, 2006
    Applicant: POSTECH FOUNDATION
    Inventors: Wonkyu Moon, Geunbae Lim, Sang Lee
  • Patent number: 6913982
    Abstract: A probe of a scanning probe microscope (SPM) having a field-effect transistor (FET) structure at the tip of the probe, and a method of fabricating the probe are provided. The SPM probe having a source, channel, and drain is formed by etching a single crystalline silicon substrate into a V-shaped groove and doping the etching sloping sides at one end of the V-shaped groove with impurities.
    Type: Grant
    Filed: January 2, 2003
    Date of Patent: July 5, 2005
    Inventors: Geunbae Lim, Yukeun Eugene Pak, Jong Up Jeon, Hyunjung Shin, Young Kuk
  • Publication number: 20030107058
    Abstract: A probe of a scanning probe microscope (SPM) having a field-effect transistor (FET) structure at the tip of the probe, and a method of fabricating the probe are provided. The SPM probe having a source, channel, and drain is formed by etching a single crystalline silicon substrate into a V-shaped groove and doping the etching sloping sides at one end of the V-shaped groove with impurities.
    Type: Application
    Filed: January 2, 2003
    Publication date: June 12, 2003
    Inventors: Geunbae Lim, Yukeun Eugene Pak, Jong Up Jeon, Hyunjung Shin, Young Kuk
  • Patent number: 6521921
    Abstract: A probe of a scanning probe microscope (SPM) having a field-effect transistor (FET) structure at the tip of the probe, and a method of fabricating the probe are provided. The SPM prove having a source, channel and drain is formed by etching a single crystalline silicon substrate into a V-shaped groove and doping the etching sloping sides at one end of the V-shaped groove with impurities.
    Type: Grant
    Filed: May 8, 2001
    Date of Patent: February 18, 2003
    Assignee: Samsung Electronics Co., LTD
    Inventors: Geunbae Lim, Yukeun Eugene Pak, Jong Up Jeon, Hyunjung Shin, Young Kuk
  • Patent number: 6443222
    Abstract: A cooling device using a capillary pumped loop (CPL), including a lower board having a looped groove formed on the upper surface, an upper board combined with the upper surface of the lower board to cover the groove, so that the flow path of a working fluid is provided, an evaporator which is provided on the flow path, and has a plurality of fine evaporating fins incorporated into the upper or lower board, and a condenser which is provided on the flow path at a predetermined distance apart from the evaporator, and has a plurality of fine condensing fins incorporated into the upper or lower board. Accordingly, a thin and small cooling device capable of performing cooling without external power can be obtained.
    Type: Grant
    Filed: November 1, 2000
    Date of Patent: September 3, 2002
    Assignee: Samsung Electronics Co., Ltd.
    Inventors: Hayong Yun, Geunbae Lim, Jung Hyun Lee, Yukeun Eugene Pak
  • Patent number: 6425439
    Abstract: A cooling device with micro cooling fins is provided. The cooling device includes a substrate, a plurality of vibrating type cooling fins extending from the substrate, and a blast fan for ventilating the substrate to cool the substrate and the vibrating type cooling fins and for causing the vibrating type cooling fins to vibrate. Accordingly, micro cooling fins formed on the surface of a substrate change the flowing path of the air and improve the performance of heat transfer near the surface of the substrate due to their vibration. In other words, the resistance to heat transfer is decreased and the performance of heat transfer is improved by disturbing the formation of a heat boundary layer, which is formed on a smooth surface. Since the cooling device provides improved heat transfer performance compared to an existing cooling device, an area and volume for heat transfer can be decreased so that the cooling device can be miniaturized.
    Type: Grant
    Filed: December 31, 2001
    Date of Patent: July 30, 2002
    Assignee: Samsung Electronics Co., Ltd.
    Inventors: Geunbae Lim, Hayong Yun, Jung Hyun Lee, Yukeun Eugene Pak, Jung-sang Ko, Sung-jin Kim
  • Publication number: 20020056543
    Abstract: A cooling device with micro cooling fins is provided. The cooling device includes a substrate, a plurality of vibrating type cooling fins extending from the substrate, and a blast fan for ventilating the substrate to cool the substrate and the vibrating type cooling fins and for causing the vibrating type cooling fins to vibrate. Accordingly, micro cooling fins formed on the surface of a substrate change the flowing path of the air and improve the performance of heat transfer near the surface of the substrate due to their vibration. In other words, the resistance to heat transfer is decreased and the performance of heat transfer is improved by disturbing the formation of a heat boundary layer, which is formed on a smooth surface. Since the cooling device provides improved heat transfer performance compared to an existing cooling device, an area and volume for heat transfer can be decreased so that the cooling device can be miniaturized.
    Type: Application
    Filed: December 31, 2001
    Publication date: May 16, 2002
    Inventors: Geunbae Lim, Hayong Yun, Jung Hyun Lee, Yukeun Eugene Pak, Jung-sang Ko, Sung-Jin Kim
  • Patent number: 6334480
    Abstract: A cooling device with micro cooling fins is provided. The cooling device includes a substrate, a plurality of vibrating type cooling fins extending from the substrate, and a blast fan for ventilating the substrate to cool the substrate and the vibrating type cooling fins and for causing the vibrating type cooling fins to vibrate. Accordingly, micro cooling fins formed on the surface of a substrate change the flowing path of the air and improve the performance of heat transfer near the surface of the substrate due to their vibration. In other words, the resistance to heat transfer is decreased and the performance of heat transfer is improved by disturbing the formation of a heat boundary layer, which is formed on a smooth surface. Since the cooling device provides improved heat transfer performance compared to an existing cooling device, an area and volume for heat transfer can be decreased so that the cooling device can be miniaturized.
    Type: Grant
    Filed: November 1, 2000
    Date of Patent: January 1, 2002
    Assignee: Samsung Electronics Co., Ltd.
    Inventors: Geunbae Lim, Hayong Yun, Jung Hyun Lee, Yukeun Eugene Pak, Jung-sang Ko, Sung-jin Kim