Patents by Inventor Geunje Park

Geunje Park has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Printed circuit board and semiconductor module including the same
    Patent number: 11758652
    Abstract: A printed circuit board (PCB) includes: an insulation substrate; a first pad on the insulation substrate; and a second pad on the insulation substrate and spaced apart from the first pad, wherein the second pad has a size substantially the same as a size of the first pad, wherein the first pad includes a first recess configured to receive a first electrode of a passive element, wherein the second pad includes a second recess receiving a second electrode of the passive element, wherein the first recess has a depth substantially the same as a thickness of the first pad, wherein the second recess has a depth substantially the same as a thickness of the second pad, wherein each of the first recess and the second recess exposes an upper surface of the insulation substrate.
    Type: Grant
    Filed: June 28, 2021
    Date of Patent: September 12, 2023
    Assignee: SAMSUNG ELECTRONICS CO., LTD.
    Inventors: Dongyoon Seo, Geunje Park, Dohyung Kim, Hwanwook Park, Dongmin Jang, Jaeseok Jang
  • PRINTED CIRCUIT BOARD AND SEMICONDUCTOR MODULE INCLUDING THE SAME
    Publication number: 20220159832
    Abstract: A printed circuit board (PCB) includes: an insulation substrate; a first pad on the insulation substrate; and a second pad on the insulation substrate and spaced apart from the first pad, wherein the second pad has a size substantially the same as a size of the first pad, wherein the first pad includes a first recess configured to receive a first electrode of a passive element, wherein the second pad includes a second recess receiving a second electrode of the passive element, wherein the first recess has a depth substantially the same as a thickness of the first pad, wherein the second recess has a depth substantially the same as a thickness of the second pad, wherein each of the first recess and the second recess exposes an upper surface of the insulation substrate.
    Type: Application
    Filed: June 28, 2021
    Publication date: May 19, 2022
    Inventors: Dongyoon SEO, Geunje PARK, Dohyung KIM, Hwanwook PARK, Dongmin JANG, Jaeseok JANG
  • Semiconductor module
    Patent number: 10952327
    Abstract: A semiconductor module includes a module substrate having a first side extending in a first direction, a plurality of upper packages disposed on a top surface of the module substrate and arranged in rows extending in the first direction, and a passive element disposed on the top surface of the module substrate. At least a portion of the passive element overlaps one of the upper packages when viewed in a plan view, and the upper packages of a first row are arranged to be shifted with respect to the upper packages of a second row in the first direction.
    Type: Grant
    Filed: January 23, 2019
    Date of Patent: March 16, 2021
    Assignee: SAMSUNG ELECTRONICS CO., LTD.
    Inventors: Jae-Seok Jang, Dongmin Jang, Geunje Park, Jaekwang Lee
  • SEMICONDUCTOR MODULE
    Publication number: 20190335586
    Abstract: A semiconductor module includes a module substrate having a first side extending in a first direction, a plurality of upper packages disposed on a top surface of the module substrate and arranged in rows extending in the first direction, and a passive element disposed on the top surface of the module substrate. At least a portion of the passive element overlaps one of the upper packages when viewed in a plan view, and the upper packages of a first row are arranged to be shifted with respect to the upper packages of a second row in the first direction.
    Type: Application
    Filed: January 23, 2019
    Publication date: October 31, 2019
    Inventors: JAE-SEOK JANG, Dongmin Jang, Geunje Park, Jaekwang Lee