Abstract: A near-field magnetically coupled anti-counterfeiting tag including a sacrificial conductive track crossing a sacrificial zone of the tag. Each segment of the sacrificial track crossing the sacrificial zone is split longitudinally into a plurality of sub-segments, the sub-segments being in electrical contact with each other at the ends of the segment.

Abstract: A near-field magnetically coupled anti-counterfeiting tag including a sacrificial conductive track crossing a sacrificial zone of the tag. Each segment of the sacrificial track crossing the sacrificial zone is split longitudinally into a plurality of sub-segments, the sub-segments being in electrical contact with each other at the ends of the segment.

Abstract: An NFC tag includes a foldable substrate in the form of a tape; an antenna located at a first end of the tape; a capacitor connected to the antenna, located at the first end of the tape; an impedance, in particular a capacitor, located at a second end of the tape; and conductive tracks running along the tape to connect the impedance to the antenna.

Abstract: A near field magnetically coupled anti-counterfeiting tag comprises a control microcircuit configured to implement a basic function and a cryptographic function; a sacrificial conductive track located across a sacrificial area of the tag; and a circuit for detecting continuity of the sacrificial track, cooperating with the microcircuit to implement the basic function without implementing the cryptographic function when the sacrificial track is broken.

Abstract: A near field magnetically coupled contactless device includes a foldable substrate in the form of a tape; two metal surfaces located facing each other on opposite sides of the substrate in a region of interest of the substrate, configured such that a piercing of the region of interest causes a permanent short circuit between the two metal surfaces; and a circuit configured to detect a short circuit between the two metal surfaces.

Abstract: An NFC tag includes a foldable substrate in the form of a tape; an antenna located at a first end of the tape; a capacitor connected to the antenna, located at the first end of the tape; an impedance, in particular a capacitor, located at a second end of the tape; and conductive tracks running along the tape to connect the impedance to the antenna.

Abstract: A near field magnetically coupled anti-counterfeiting tag comprises a control microcircuit configured to implement a basic function and a cryptographic function; a sacrificial conductive track located across a sacrificial area of the tag; and a circuit for detecting continuity of the sacrificial track, cooperating with the microcircuit to implement the basic function without implementing the cryptographic function when the sacrificial track is broken.

Abstract: A near field magnetically coupled contactless device, comprises a foldable substrate in the form of a tape; an antenna circuit tuned to a nominal frequency, including an antenna and a capacitor connected to the antenna; a sacrificial impedance connected to the antenna circuit to contribute to the tuning of the antenna circuit to the nominal frequency; and a sacrificial structure comprising a conductive track connecting the sacrificial impedance to the antenna circuit, configured in meanders occupying a region of interest of the substrate such that a piercing of the region of interest severs the conductive track.

Abstract: The present invention relates to a method for manufacturing an object integrating a contactless microcircuit, the method including steps of: forming an antenna coil in the shape of a spiral from a first face of a medium, forming on the medium first and second conducting pads respectively coupled to internal and external ends of the spiral of the antenna coil, connecting the connection terminals of the microcircuit to third and fourth conducting pads, and fixing the microcircuit onto the medium by arranging opposite one another the first and the third conducting pad, and opposite one another the second and the fourth conducting pad, the first to fourth conducting pads forming two capacitors mounted in series with the antenna coil, the antenna coil and the first and second conducting pads being formed by inserting a conducting wire into the medium.

Abstract: The invention relates to a method for manufacturing a contactless microcircuit antenna coil, including steps of: depositing a first electrically conducting layer on a first face of a wafer, and forming in the first layer an antenna coil in a spiral having several turns, including an internal turn coupled to an internal contact pad and an external turn coupled to an external contact pad, the external turn following the entire contour of antenna coil except for a zone through which a conducting path coupling the external contact pad to the external turn can pass, the external and internal contact pads of the antenna coil being formed in a central zone of the external turn, the antenna coil having a bypass zone in which each turn bypasses the external contact pad.

Abstract: The present invention relates to a method for manufacturing an object integrating a contactless microcircuit, the method including steps of: forming an antenna coil in the shape of a spiral on a first face of a medium, fixing the microcircuit onto the medium, forming on the medium first and second conducting pads respectively coupled to ends internal and external to the spiral of the antenna coil, connecting the connection terminals of the microcircuit to third and fourth conducting pads, and fixing the microcircuit onto the medium, by arranging opposite one another the first and the third conducting pad, and opposite one another the second and the fourth conducting pad, so as to form two capacitors mounted in series with the antenna coil, the first or second conducting pad including a non-conducting window opposite which the microcircuit is placed.

Abstract: The invention relates to a method for manufacturing a contactless microcircuit antenna coil, including steps of: depositing a first electrically conducting layer on a first face of a wafer, and forming in the first layer an antenna coil in a spiral having several turns, including an internal turn coupled to an internal contact pad and an external turn coupled to an external contact pad, the external turn following the entire contour of antenna coil except for a zone through which a conducting path coupling the external contact pad to the external turn can pass, the external and internal contact pads of the antenna coil being formed in a central zone of the external turn, the antenna coil having a bypass zone in which each turn bypasses the external contact pad.