Patents by Inventor Ghyath Issak

Ghyath Issak has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Ball attached zero insertion force socket
    Patent number: 6644985
    Abstract: A system and method for mechanically and electrically connecting an electronic component and a circuit substrate using a Zero Insertion Force (ZIF) socket. The ZIF socket having a plurality of press-fit contact assemblies and a housing with middle plate that is selectively movable between a contact and non-contact position. Each contact assembly being secured to the ZIF socket housing by press-fitting the lower portion of the contact assembly such that each contact assembly is anchored to an aperture in the housing bottom by compressive force. The ZIF socket is mounted to the circuit substrate and the electronic component is mounted on to the ZIF socket. The contact assemblies of the ZIF socket are selectively movable between a contact and non-contact position. The press-fit contact assemblies form a seal to prevent solder wick-up.
    Type: Grant
    Filed: February 16, 2001
    Date of Patent: November 11, 2003
    Assignee: FCI Americas Technology, Inc.
    Inventors: John W. Wilson, Rex W. Keller, Ghyath Issak
  • Ball attached zero insertion force socket
    Publication number: 20020115324
    Abstract: A system and method for mechanically and electrically connecting an electronic component and a circuit substrate using a Zero Insertion Force (ZIF) socket. The ZIF socket having a plurality of press-fit contact assemblies and a housing with middle plate that is selectively movable between a contact and non-contact position. Each contact assembly being secured to the ZIF socket housing by press-fitting the lower portion of the contact assembly such that each contact assembly is anchored to an aperture in the housing bottom by compressive force. The ZIF socket is mounted to the circuit substrate and the electronic component is mounted on to the ZIF socket. The contact assemblies of the ZIF socket are selectively movable between a contact and non-contact position.
    Type: Application
    Filed: February 16, 2001
    Publication date: August 22, 2002
    Inventors: John W. Wilson, Rex W. Keller, Ghyath Issak