Patents by Inventor Gi Bong Chung

Gi Bong Chung has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • POLYAMIDE RESIN COMPOSITION
    Publication number: 20240117146
    Abstract: A polyamide resin composition using a recycled carbon fiber to establish reasonable manufacturing costs. The polyamide resin composition has excellent processability and can be used for injection molding, so that molded products with various structures can be made from the polyamide resin composition. In addition, good mechanical properties of the polyamide resin composition enable applications in various fields.
    Type: Application
    Filed: June 30, 2023
    Publication date: April 11, 2024
    Applicants: HYUNDAI MOTOR COMPANY, KIA CORPORATION, KOLON PLASTICS, INC.
    Inventors: Dong Jun Lee, Gi Bong Chung, Soo Yeon Park
  • Resin composition for camera module having excellent laser transmittance and camera lens module member produced using the same
    Patent number: 11407892
    Abstract: The present disclosure is directed to a resin composition for a camera module having excellent laser transmittance and a camera module member produced using the same. In one embodiment, the resin composition for a camera module includes: 25 to 50 wt % of a polycarbonate resin; 5 to 30 wt % of a polycyclohexylenedimethylene terephthalate (PCT) resin; 30 to 50 wt % of a fibrous filler; and 0.001 to 5 wt % of a dye.
    Type: Grant
    Filed: September 8, 2020
    Date of Patent: August 9, 2022
    Assignees: HYUNDAI MOBIS CO., LTD., KOLON PLASTICS, INC.
    Inventors: Hyoung Taek Kang, Keun Hyung Lee, Hyeon Don Kim, Seong Hyeon Myeong, Gi Bong Chung
  • RESIN COMPOSITION FOR CAMERA MODULE HAVING EXCELLENT LASER TRANSMITTANCE AND CAMERA LENS MODULE MEMBER PRODUCED USING THE SAME
    Publication number: 20210070985
    Abstract: The present disclosure is directed to a resin composition for a camera module having excellent laser transmittance and a camera module member produced using the same. In one embodiment, the resin composition for a camera module includes: 25 to 50 wt % of a polycarbonate resin; 5 to 30 wt % of a polycyclohexylenedimethylene terephthalate (PCT) resin; 30 to 50 wt % of a fibrous filler; and 0.001 to 5 wt % of a dye.
    Type: Application
    Filed: September 8, 2020
    Publication date: March 11, 2021
    Inventors: Hyoung Taek Kang, Keun Hyung Lee, Hyeon Don Kim, Seong Hyeon Myeong, Gi Bong Chung