Patents by Inventor Gi-Bong LEE

Gi-Bong LEE has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20240117146
    Abstract: A polyamide resin composition using a recycled carbon fiber to establish reasonable manufacturing costs. The polyamide resin composition has excellent processability and can be used for injection molding, so that molded products with various structures can be made from the polyamide resin composition. In addition, good mechanical properties of the polyamide resin composition enable applications in various fields.
    Type: Application
    Filed: June 30, 2023
    Publication date: April 11, 2024
    Applicants: HYUNDAI MOTOR COMPANY, KIA CORPORATION, KOLON PLASTICS, INC.
    Inventors: Dong Jun Lee, Gi Bong Chung, Soo Yeon Park
  • Patent number: 9564340
    Abstract: A method of manufacturing a semiconductor device includes forming a plurality of active fins over a semiconductor substrate, sequentially forming first and second hard mask layers over the active fins, forming a first hard mask pattern by etching the second hard mask layer, trimming the first hard mask pattern to form a trimmed hard mask pattern, forming a first photo resist pattern over the first hard mask layer, forming second hard mask patterns by etching the first hard mask layer by using the trimmed hard mask pattern and the first photo resist pattern as an etching mask, and forming active fin patterns by etching the active fins by using the second hard mask patterns as an etching mask.
    Type: Grant
    Filed: December 2, 2015
    Date of Patent: February 7, 2017
    Assignee: SAMSUNG ELECTRONICS CO., LTD.
    Inventors: Gi-bong Lee, Wook-hyun Kwon, Kyung-soo Kim, Seon-ah Nam, Yeon-ho Park, Nak-jin Son
  • Publication number: 20160225635
    Abstract: A method of manufacturing a semiconductor device includes forming a plurality of active fins over a semiconductor substrate, sequentially forming first and second hard mask layers over the active fins, forming a first hard mask pattern by etching the second hard mask layer, trimming the first hard mask pattern to form a trimmed hard mask pattern, forming a first photo resist pattern over the first hard mask layer, forming second hard mask patterns by etching the first hard mask layer by using the trimmed hard mask pattern and the first photo resist pattern as an etching mask, and forming active fin patterns by etching the active fins by using the second hard mask patterns as an etching mask.
    Type: Application
    Filed: December 2, 2015
    Publication date: August 4, 2016
    Inventors: Gi-bong LEE, Wook-hyun KWON, Kyung-soo KIM, Seon-ah NAM, Yeon-ho PARK, Nak-jin SON
  • Publication number: 20080176089
    Abstract: Provided is a wallpaper type decoration panel having a decoration pattern of an unevenness form, which is formed by compressing and molding an intermediate member and a finish member on a board member under a high temperature and high pressure. Accordingly, the pattern of the intermediate member is protruded as the decoration pattern, to thus fulfill various consumer's aesthetic desires and to maximize reliability of use. An embroidered fabric or a flocking processed fabric is used as the intermediate member, or a flocking is directly attached on the upper surface of the board member or the inner side surface of the finish member. Accordingly, various decoration patterns are effectively produced, to thereby improve productivity and provide an effect of reducing a manufacturing cost.
    Type: Application
    Filed: January 17, 2008
    Publication date: July 24, 2008
    Inventor: Gi-Bong LEE