Patents by Inventor Gi Eun LEE

Gi Eun LEE has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 9961790
    Abstract: A printed circuit board (PCB) having an improved waterproof structure for preventing corrosion of a substrate is disclosed. A plurality of screen-printed protrusions is provided at the PCB surface. The plurality of protrusions allow water to be formed in waterdrops so that the waterdrops can flow to the outside of the PCB. The PCB is arranged to have a tilted structure for facilitating discharge of the water. The tilted structure discharges waterdrops to a lower side of the PCB. The PCB and a PCB assembly having the same are applicable to electronic appliances such as a washing machine.
    Type: Grant
    Filed: August 13, 2015
    Date of Patent: May 1, 2018
    Assignee: SAMSUNG ELECTRONICS CO., LTD.
    Inventors: Kyu Sik Kim, Gi Eun Lee
  • Publication number: 20170280575
    Abstract: A printed circuit board (PCB) having an improved waterproof structure for preventing corrosion of a substrate is disclosed. A plurality of screen-printed protrusions is provided at the PCB surface. the plurality of protrusions allow water to be formed in waterdrops so that the waterdrops can flow to the outside of the PCB. The PCB is arranged to have a tilted structure for facilitating discharge of the water. The tilted structure discharges waterdrops to a lower side of the PCB. The PCB and a PCB assembly having the same are applicable to electronic appliances such as a washing machine.
    Type: Application
    Filed: August 13, 2015
    Publication date: September 28, 2017
    Applicant: SAMSUNG ELECTRONICS CO., LTD.
    Inventors: Kyu Sik KIM, Gi Eun LEE