Abstract: A printed circuit board, an electronic module and a method of manufacturing the printed circuit board are provided. The printed circuit board includes a plurality of insulation layers, metal layers formed on the plurality of insulation layers, a via formed for interlayer electrical connection of the metal layers, a trench penetrating the insulation layers, and a heat-transfer structure formed in the trench.

Abstract: A printed circuit board, an electronic module and a method of manufacturing the printed circuit board are provided. The printed circuit board includes a plurality of insulation layers, metal layers formed on the plurality of insulation layers, a via formed for interlayer electrical connection of the metal layers, a trench penetrating the insulation layers, and a heat-transfer structure formed in the trench.

Abstract: The present invention relates to a detach core substrate and a method of manufacturing a detach core substrate. In accordance with one embodiment of the present invention, there is proposed a detach core substrate that a conductive layer including a metal layer with an etching property different from copper is formed on a top surface and a bottom surface of an insulating layer formed thereon a surface roughness. At this time, the contact interface between the top surface and the bottom surface of the insulating layer is the detachment interface to be separated during the manufacture of the circuit board. In addition, a method of manufacturing the detach core substrate is proposed.

Abstract: There are provided a printed circuit board and a method of manufacturing the same. The printed circuit board according to an exemplary embodiment of the present disclosure includes: a first insulating layer; a second insulating layer formed below the first insulating layer; a via pad formed on an upper surface of the second insulating layer and formed so as to be buried in the second insulating layer; a double via formed on an upper surface of the via pad, formed so as to penetrate through the first insulating layer, and including an auxiliary via and a first via; and a second via formed on a lower surface of the via pad and formed so as to penetrate through the second insulating layer.

Abstract: Disclosed herein is a printed circuit board, including: a substrate; a seed layer formed on the substrate; and a circuit pattern formed on the seed layer and formed so that a diameter of an upper portion thereof and a width of a lower portion thereof are equal to each other or a diameter of the lower portion is larger than that of the upper portion. Therefore, the printed circuit board according to a preferred embodiment of the present invention forms the circuit pattern having the lower portion having the diameter larger than that of the upper portion, such that the electrical signal loss may be decreased and separation of the circuit pattern may be prevented, thereby improving whole reliability of the board.

Abstract: There is provided a method for manufacturing a printed circuit board including: preparing a substrate having a conductive layer formed on at least a portion thereof; forming an insulating layer formed with an opening through which a portion of the conductive layer is exposed on the substrate; forming a plating seed layer on the insulating layer and the exposed conductive layer; forming an electroplating layer on the plating seed layer by overplating the plating seed layer; and etching the overplated portion in a lump to form a circuit layer in the opening.

Abstract: Disclosed herein is an interposer, including: an interposer substrate configured by stacking an insulating layer of one layer or more and interlayer connected through a via; a cavity penetrating through a center of the interposer substrate in a thickness direction; and a connection electrode having a post part which is disposed on at least one of an upper surface and a lower surface of the interposer substrate, thereby increasing electrical characteristics and reducing manufacturing cost and time.

Abstract: The present invention relates to a particle dispersion device including: an injection unit for injecting particles; a chamber for preventing diffusion of the particles injected by the injection unit; and a dispersion unit formed inside the chamber to disperse the injected particles.

Abstract: Provided is a method for manufacturing an antenna which is minimized and used in a low frequency band. The method includes forming and preparing a radiator for an antenna, mounting the radiator inside a dam molding part including an upper dam molding part and a lower dam molding part, injecting a molding material into the dam molding part through an inlet provided at one side of the dam molding part, the molding material including a composite material with a controlled diameter and content, hardening the injected molding material, and separating the hardened molding material covering the radiator from the dam molding part. Accordingly, a miniaturized antenna can be provided, which can achieve a high integration density, prevent deformation of the radiator caused by external pressure generated in processes, and be used in a low frequency band by covering the radiator with a molding material having a high permittivity and a low-loss characteristic.

Abstract: Provided is a method for manufacturing an antenna which is minimized and used in a low frequency band. The method includes forming and preparing a radiator for an antenna, mounting the radiator inside a dam molding part including an upper dam molding part and a lower dam molding part, injecting a molding material into the dam molding part through an inlet provided at one side of the dam molding part, the molding material including a composite material with a controlled diameter and content, hardening the injected molding material, and separating the hardened molding material covering the radiator from the dam molding part. Accordingly, a miniaturized antenna can be provided, which can achieve a high integration density, prevent deformation of the radiator caused by external pressure generated in processes, and be used in a low frequency band by covering the radiator with a molding material having a high permittivity and a low-loss characteristic.

Abstract: A front end module is disclosed. The front end module includes a plurality of antennas receiving different frequency band signals, respectively, an impedance matching circuit unit comprising a plurality of tuners respectively connected to the plurality of antennas to control impedance matching, a selection unit selecting one frequency band signal from multiple frequency band signals passing through the impedance matching circuit unit, a measuring unit measuring signal strength of a received signal selected at the selection unit, and a control unit controlling an operation of the selection unit and an impedance of the tuner according to the signal strength of the received signal measured at the measuring unit.