Patents by Inventor Gi Ho Jeong
Gi Ho Jeong has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 11990692Abstract: An antenna module according to an embodiment of the present disclosure includes a main board, a ground area formed in a rectangular shape on at least a portion of a main board, a pair of power feeding units formed at edge portions of the ground area while being spaced apart from each other, and a pair of monopole antennas electrically connected to the power feeding units, respectively, and disposed on the ground area while protruding from the ground area. The monopole antennas may be configured to be asymmetric about the feeding unit.Type: GrantFiled: May 14, 2020Date of Patent: May 21, 2024Assignee: KESPION CO., LTD.Inventors: Won Mo Seong, Ui Sheon Kim, Se Ah Choi, Gi Ho Kim, Hyun Seob Jeong
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Patent number: 8779561Abstract: Disclosed herein is a Light Emitting Diode (LED) backlight unit without a Printed Circuit board (PCB). The LED backlight unit includes a chassis, insulating resin layer, and one or more light source modules. The insulating resin layer is formed on the chassis. The circuit patterns are formed on the insulating resin layer. The light source modules are mounted on the insulating resin layer and are electrically connected to the circuit patterns. The insulating resin layer has a thickness of 200 ?m or less, and is formed by laminating solid film insulating resin on the chassis or by applying liquid insulating resin to the chassis using a molding method employing spin coating or blade coating. Furthermore, the circuit patterns are formed by filling the engraved circuit patterns of the insulating resin layer with metal material.Type: GrantFiled: May 13, 2010Date of Patent: July 15, 2014Assignee: Samsung Electronics Co., Ltd.Inventors: Gi Ho Jeong, Si Young Yang, Jae Wook Kwon, Jeong Hoon Park, Hyun Ju Yi, Choon Keun Lee
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Patent number: 8053804Abstract: Disclosed herein is a backlight unit equipped with LEDs. The backlight includes an insulating substrate, a plurality of LED packages, an upper heat dissipation plate, and a lower heat dissipation plate. The insulating substrate is provided with predetermined circuit patterns. The LED packages are mounted above the insulating substrate, and are electrically connected to the circuit patterns. The upper heat dissipation plate is formed on the insulating substrate, and is configured to come into contact with the circuit patterns and to dissipate heat. The lower heat dissipation plate is formed on the insulating substrate, and is configured to transmit heat transmitted through the upper heat dissipation plate. The upper heat dissipation plate and the lower heat dissipation plate are connected to each other by at least one through hole, and the through hole and the upper heat dissipation plate have a predetermined area ratio.Type: GrantFiled: January 26, 2010Date of Patent: November 8, 2011Assignee: Samsung LED Co., Ltd.Inventors: Gi Ho Jeong, Jae Wook Kwon, Dong Jin Kim, Yoon Tak Yang, Hyeong Won Yun, Hyun Ho Lee, Jeong Hoon Park
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Patent number: 7795635Abstract: Disclosed herein is a backlight unit equipped with LEDs. The backlight includes an insulating substrate, a plurality of LED packages, an upper heat dissipation plate, and a lower heat dissipation plate. The insulating substrate is provided with predetermined circuit patterns. The LED packages are mounted above the insulating substrate, and are electrically connected to the circuit patterns. The upper heat dissipation plate is formed on the insulating substrate, and is configured to come into contact with the circuit patterns and to dissipate heat. The lower heat dissipation plate is formed on the insulating substrate, and is configured to transmit heat transmitted through the upper heat dissipation plate. The upper heat dissipation plate and the lower heat dissipation plate are connected to each other by at least one through hole, and the through hole and the upper heat dissipation plate have a predetermined area ratio.Type: GrantFiled: March 6, 2007Date of Patent: September 14, 2010Assignee: Samsung LED Co., Ltd.Inventors: Gi Ho Jeong, Jae Wook Kwon, Dong Jin Kim, Yoon Tak Yang, Hyeong Won Yun, Hyun Ho Lee, Jeong Hoon Park
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Publication number: 20100227423Abstract: Disclosed herein is a Light Emitting Diode (LED) backlight unit without a Printed Circuit board (PCB). The LED backlight unit includes a chassis, insulating resin layer, and one or more light source modules. The insulating resin layer is formed on the chassis. The circuit patterns are formed on the insulating resin layer. The light source modules are mounted on the insulating resin layer and are electrically connected to the circuit patterns. The insulating resin layer has a thickness of 200 ?m or less, and is formed by laminating solid film insulating resin on the chassis or by applying liquid insulating resin to the chassis using a molding method employing spin coating or blade coating. Furthermore, the circuit patterns are formed by filling the engraved circuit patterns of the insulating resin layer with metal material.Type: ApplicationFiled: May 13, 2010Publication date: September 9, 2010Applicant: Samsung Electro-Mechanics Co., Ltd.Inventors: Gi Ho JEONG, Si Young Yang, Jae Wook Kwon, Jeong Hoon Park, Hyun Ju Yi, Choon Keun Lee
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Publication number: 20100127281Abstract: Disclosed herein is a backlight unit equipped with LEDs. The backlight includes an insulating substrate, a plurality of LED packages, an upper heat dissipation plate, and a lower heat dissipation plate. The insulating substrate is provided with predetermined circuit patterns. The LED packages are mounted above the insulating substrate, and are electrically connected to the circuit patterns. The upper heat dissipation plate is formed on the insulating substrate, and is configured to come into contact with the circuit patterns and to dissipate heat. The lower heat dissipation plate is formed on the insulating substrate, and is configured to transmit heat transmitted through the upper heat dissipation plate. The upper heat dissipation plate and the lower heat dissipation plate are connected to each other by at least one through hole, and the through hole and the upper heat dissipation plate have a predetermined area ratio.Type: ApplicationFiled: January 26, 2010Publication date: May 27, 2010Applicant: Samsung Electro-Mechanics Co., Ltd.Inventors: Gi Ho JEONG, Jae Wook Kwon, Dong Jin Kim, Yoon Tak Yang, Hyeong Won Yun, Hyun Ho Lee, Jeong Hoon Park
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Publication number: 20070221941Abstract: Disclosed herein is a backlight unit equipped with LEDs. The backlight includes an insulating substrate, a plurality of LED packages, an upper heat dissipation plate, and a lower heat dissipation plate. The insulating substrate is provided with predetermined circuit patterns. The LED packages are mounted above the insulating substrate, and are electrically connected to the circuit patterns. The upper heat dissipation plate is formed on the insulating substrate, and is configured to come into contact with the circuit patterns and to dissipate heat. The lower heat dissipation plate is formed on the insulating substrate, and is configured to transmit heat transmitted through the upper heat dissipation plate. The upper heat dissipation plate and the lower heat dissipation plate are connected to each other by at least one through hole, and the through hole and the upper heat dissipation plate have a predetermined area ratio.Type: ApplicationFiled: March 6, 2007Publication date: September 27, 2007Inventors: Gi Ho Jeong, Jae Wook Kwon, Dong Jin Kim, Yoon Tak Yang, Hyeong Won Yun, Hyun Ho Lee, Jeong Hoon Park
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Publication number: 20070221942Abstract: Disclosed herein is a Light Emitting Diode (LED) backlight unit without a Printed Circuit board (PCB). The LED backlight unit includes a chassis, insulating resin layer, and one or more light source modules. The insulating resin layer is formed on the chassis. The circuit patterns are formed on the insulating resin layer. The light source modules are mounted on the insulating resin layer and are electrically connected to the circuit patterns. The insulating resin layer has a thickness of 200 ?m or less, and is formed by laminating solid film insulating resin on the chassis or by applying liquid insulating resin to the chassis using a molding method employing spin coating or blade coating. Furthermore, the circuit patterns are formed by filling the engraved circuit patterns of the insulating resin layer with metal material.Type: ApplicationFiled: March 19, 2007Publication date: September 27, 2007Inventors: Gi Ho Jeong, Si Young Yang, Jae Wook Kwon, Jeong Hoon Park, Hyun Ju Yi, Choon Keun Lee