Patents by Inventor Gi-Hwan BAE

Gi-Hwan BAE has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 12267631
    Abstract: Disclosed is a network-on-chip including a first data converter that receives first image data and second image data from at least one image sensor and encodes one image data among the first image data and the second image data, into first data, based on whether the first image data is identical to the second image data and a second data converter that receives non-image data from at least one non-image sensor and encodes the received non-image data into second data. The network-on-chip outputs the first data and the second data to transmit the first data and the second data to an external server at a burst length.
    Type: Grant
    Filed: August 11, 2021
    Date of Patent: April 1, 2025
    Assignee: ELECTRONICS AND TELECOMMUNICATIONS RESEARCH INSTITUTE
    Inventors: Sukho Lee, Sang Pil Kim, Young Hwan Bae, Jae-Jin Lee, Kyuseung Han, Tae Wook Kang, Sung Eun Kim, Hyuk Kim, Kyung Hwan Park, Hyung-Il Park, Kyung Jin Byun, Kwang Il Oh, In Gi Lim
  • Patent number: 10166652
    Abstract: Provided are a device and method for polishing a substrate, in which an upper ground surface, a side surface and a lower ground surface of a substrate can be simultaneously polished, and a polishing wheel can be evenly used on the whole so as to be uniformly abraded. A substrate polishing system is to polish a substrate, of which upper edge and a lower edge are polished, and includes: a table, on which the substrate is secured; a spindle provided at the upper portion of a side surface of the table; a polishing wheel formed in the shape of a cylinder and having a rotating shaft mounted perpendicularly to the substrate, so as to polish the substrate with a side surface thereof while rotating by the spindle; and a Z axis movement means for moving the polishing wheel in the vertical direction during the polishing of the substrate.
    Type: Grant
    Filed: June 2, 2016
    Date of Patent: January 1, 2019
    Assignees: KNJ CO., LTD., SAMSUNG DISPLAY CO., LTD.
    Inventors: Gi-Hwan Bae, Jun-Woo Hong
  • Publication number: 20160354895
    Abstract: Provided are a device and method for polishing a substrate, in which an upper ground surface, a side surface and a lower ground surface of a substrate can be simultaneously polished, and a polishing wheel can be evenly used on the whole so as to be uniformly abraded. A substrate polishing system is to polish a substrate, of which upper edge and a lower edge are polished, and includes: a table, on which the substrate is secured; a spindle provided at the upper portion of a side surface of the table; a polishing wheel formed in the shape of a cylinder and having a rotating shaft mounted perpendicularly to the substrate, so as to polish the substrate with a side surface thereof while rotating by the spindle; and a Z axis movement means for moving the polishing wheel in the vertical direction during the polishing of the substrate.
    Type: Application
    Filed: June 2, 2016
    Publication date: December 8, 2016
    Inventors: Gi-Hwan BAE, Jun-Woo HONG